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参数资料
| 型号： | STM32F103RCY7TR |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PBGA64 |
| 封装： | 4.466 X 4.395 MM, 0.50 MM PITCH, ROHS COMPLIANT, WLCSP-64 |
| 文件页数： | 17/122页 |
| 文件大小： | 1599K |
| 代理商： | STM32F103RCY7TR |
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STM32F103xC, STM32F103xD, STM32F103xE
Package characteristics
Doc ID 14611 Rev 6
113/122
6.2
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max x JA)
Where:
●
TA max is the maximum ambient temperature in °C,
●
JA is the package junction-to-ambient thermal resistance, in C/W,
●
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
●
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = (VOL × IOL) + ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
6.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
Table 70.
Package thermal characteristics
Symbol
Parameter
Value
Unit
JA
Thermal resistance junction-ambient
LFBGA144 - 10 × 10 mm / 0.5 mm pitch
40
°C/W
Thermal resistance junction-ambient
LQFP144 - 20 × 20 mm / 0.5 mm pitch
30
Thermal resistance junction-ambient
LFBGA100 - 10 × 10 mm / 0.5 mm pitch
40
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
46
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
45
Thermal resistance junction-ambient
WLCSP64
50
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相关代理商/技术参数 |
参数描述 |
|---|---|
| STM32F103RCY7XXX | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces |
| STM32F103RD | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces |
| STM32F103RDH6TR | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces |
| STM32F103RDH6XXX | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces |
| STM32F103RDH7TR | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces |
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