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参数资料
型号： STM32F103T6U6AXX
厂商： STMICROELECTRONICS
元件分类： 微控制器/微处理器
英文描述： 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PQCC36
封装： 6 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, VFQFPN-36
文件页数： 81/83页
文件大小： 998K
代理商： STM32F103T6U6AXX
Revision history
STM32F103x6, STM32F103x8, STM32F103xB
82/83
14-Mar-2008
5
Figure 2: Clock tree on page 17 added.
Maximum TJ value given in Table 7: Thermal characteristics on
page 32.
CRC feature added (see CRC (cyclic redundancy check) calculation
unit on page 9 and Figure 8: Memory map on page 27 for address).
IDD modified in Table 15: Typical and maximum current consumptions in
Stop and Standby modes.
ACCHSI modified in Table 24: HSI oscillator characteristics on page 47,
note 2 removed.
PD, TA and TJ added, tprog values modified and tprog description clarified
in Table 28: Flash memory characteristics on page 49.
tRET modified in Table 29: Flash memory endurance and data retention.
VNF(NRST) unit corrected in Table 37: NRST pin characteristics on
page 55.
Table 41: SPI characteristics on page 59 modified.
IVREF added to Table 45: ADC characteristics on page 63.
Table 47: ADC accuracy - limited test conditions added. Table 48: ADC
accuracy modified.
LQFP100 package specifications updated (see Section 6: Package
characteristics on page 68).
Recommended LQFP100, LQFP 64, LQFP48 and VFQFPN36
footprints added (see Figure 38, Figure 40, Figure 42 and Figure 34).
Section 6.2: Thermal characteristics on page 75 modified,
Section 6.2.1 and Section 6.2.2 added.
Appendix A: Important notes on page 81 removed.
21-Mar-2008
6
Small text changes. Figure 8: Memory map clarified.
In Table 29: Flash memory endurance and data retention:
–NEND tested over the whole temperature range
– cycling conditions specified for tRET
–tRET min modified at TA = 55 °C
V25, Avg_Slope and TL modified in Table 49: TS characteristics.
CRC feature removed.
22-May-2008
7
CRC feature added back. Small text changes. Section 1: Introduction
modified. Section 2.2: Full compatibility throughout the family added.
IDD at TA max = 105 °C added to Table 15: Typical and maximum
current consumptions in Stop and Standby modes on page 37.
IDD_VBAT removed from Table 18: Typical current consumption in
Standby mode on page 42.
Values added to Table 40: SCL frequency (fPCLK1= 36 MHz.,VDD =
3.3 V) on page 58.
Figure 25: SPI timing diagram - slave mode and CPHA = 0 on page 60
modified. Equation 1 corrected.
tRET at TA = 105 °C modified in Table 29: Flash memory endurance and
data retention on page 49.
VUSB added to Table 43: USB DC electrical characteristics on page 62.
Figure 43: LQFP100 PD max vs. TA on page 77 modified.
Axx option added to Table 56: Ordering information scheme on
page 78.
Table 57.
Document revision history (continued)
Date
Revision
Changes
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相关代理商/技术参数
参数描述
STM32F103T6U6AXXX 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 communication interfaces
STM32F103T6U6TR 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 communication interfaces
STM32F103T6U6XXX 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 communication interfaces
STM32F103T6U7A 功能描述:ARM微控制器 - MCU 32BIT Cortex M3 L/D Performance LINE RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 处理器系列:STM32F373xx 数据总线宽度:32 bit 最大时钟频率:72 MHz 程序存储器大小:256 KB 数据 RAM 大小:32 KB 片上 ADC:Yes 工作电源电压:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:LQFP-48 安装风格:SMD/SMT
STM32F103T6U7ATR 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 communication interfaces
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