参数资料
型号: STM8AF52AATDY
厂商: STMICROELECTRONICS
元件分类: 微控制器/微处理器
英文描述: 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PQFP80
封装: 14 X 14 MM, ROHS COMPLIANT, LQFP-80
文件页数: 117/120页
文件大小: 2236K
代理商: STM8AF52AATDY
Electrical characteristics
STM8AF52/62xx, STM8AF51/61xx
Doc ID 14395 Rev 7
10.4
Thermal characteristics
In case the maximum chip junction temperature (TJmax) specified in Table 40: General
operating conditions is exceeded, the functionality of the device cannot be guaranteed.
TJmax, in degrees Celsius, may be calculated using the following equation:
Equation 3
TJmax = TAmax + (PDmax x ΘJA)
where:
TAmax is the maximum ambient temperature in °C
ΘJA is the package junction-to-ambient thermal resistance in ° C/W
PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)
PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/Omax represents the maximum power dissipation on output pins
where:
Equation 4
PI/Omax = Σ (VOL * IOL) + Σ((VDD - VOH) * IOH)
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low- and high-level in the
application.
10.4.1
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural
convection (still air). Available from www.jedec.org.
Table 65.
Thermal characteristics(1)
1.
Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
environment.
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
LQFP 80 - 14 x 14 mm
38
°C/W
ΘJA
Thermal resistance junction-ambient
LQFP 64 - 10 x 10 mm
46
°C/W
ΘJA
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm
57
°C/W
ΘJA
Thermal resistance junction-ambient
LQFP 32 - 7 x 7 mm
59
°C/W
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