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参数资料
| 型号： | STPS30L30CTPBF |
| 厂商： | VISHAY INTERTECHNOLOGY INC |
| 元件分类： | 整流器 |
| 英文描述： | 15 A, 30 V, SILICON, RECTIFIER DIODE, TO-220AB |
| 封装： | LEAD FREE, PLASTIC PACKAGE-3 |
| 文件页数： | 6/7页 |
| 文件大小： | 132K |
| 代理商： | STPS30L30CTPBF |
Document Number: 95222
For technical questions within your region, please contact one of the following:
www.vishay.com
Revision: 08-Mar-11
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
1
TO-220AB
Outline Dimensions
Vishay Semiconductors
DIMENSIONS in millimeters and inches
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Lead dimension and finish uncontrolled in L1
(3) Dimension D, D1 and E do not include mold flash. Mold flash
shall not exceed 0.127 mm (0.005") per side. These dimensions
are measured at the outermost extremes of the plastic body
(4) Dimension b1, b3 and c1 apply to base metal only
(5) Controlling dimensions: inches
(6) Thermal pad contour optional within dimensions E, H1, D2 and
E1
(7) Dimensions E2 x H1 define a zone where stamping and
singulation irregularities are allowed
(8) Outline conforms to JEDEC TO-220, except A2 (maximum) and
D2 (minimum) where dimensions are derived from the actual
package outline
SYMBOL
MILLIMETERS
INCHES
NOTES
SYMBOL
MILLIMETERS
INCHES
NOTES
MIN.
MAX.
MIN.
MAX.
MIN.
MAX.
MIN.
MAX.
A
4.25
4.65
0.167
0.183
E
10.11
10.51
0.398
0.414
3, 6
A1
1.14
1.40
0.045
0.055
E1
6.86
8.89
0.270
0.350
6
A2
2.56
2.92
0.101
0.115
E2
-
0.76
-
0.030
7
b
0.69
1.01
0.027
0.040
e
2.41
2.67
0.095
0.105
b1
0.38
0.97
0.015
0.038
4
e1
4.88
5.28
0.192
0.208
b2
1.20
1.73
0.047
0.068
H1
6.09
6.48
0.240
0.255
6, 7
b3
1.14
1.73
0.045
0.068
4
L
13.52
14.02
0.532
0.552
c
0.36
0.61
0.014
0.024
L1
3.32
3.82
0.131
0.150
2
c1
0.36
0.56
0.014
0.022
4
P
3.54
3.73
0.139
0.147
D
14.85
15.25
0.585
0.600
3
Q
2.60
3.00
0.102
0.118
D1
8.38
9.02
0.330
0.355
90° to 93°
D2
11.68
12.88
0.460
0.507
6
13
2
D
D1
H1
Q
13
2
C
D
3 x b2
3 x b
(b, b2)
b1, b3
(H1)
D2
Detail B
C
A
B
L
e1
Lead tip
E
E2
P
0.014
A
B
M
0.015
A
B
MM
Seating
plane
c
A2
A1
A
Lead assignments
Diodes
1. - Anode/open
2. - Cathode
3. - Anode
Conforms to JEDEC outline TO-220AB
(6)
(7)
(6)
(7)
e
2 x
L1 (2)
Detail B
Section C - C and D - D
View A - A
Base metal
Plating
(4)
c1
c
(6)
Thermal pad
(E)
E1
(6)
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相关代理商/技术参数 |
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