■ Up to 48 full-duplex CDR-based transceivers in Stratix IV GX and GT devICes
supporting data rates up to 8.5 Gbps and 11.3 Gbps, respectively
■ Dedicated circuitry to support physical layer functionality for popular serial
protocols, such as PCI Express (PCIe) (PIPE) Gen1 and Gen2, Gbps Ethernet (GbE),
Serial RapidIO, SONET/SDH, XAUI/HiGig, (OIF) CEI-6G, SD/HD/3G-SDI, Fibre
Channel, SFI-5, and Interlaken
■ Complete PCIe protocol solution with embedded PCIe hard IP BLOCKs that
implement PHY-MAC layer, Data Link layer, and Transaction layer functionality
f For more information, refer to the IP Compiler for PCI Express User Guide.
■ Programmable transmitter pre-emphasis and receiver equalization circuitry to
compensate for frequency-dependent losses in the physical medium
■ Typical physical medium attachment (PMA) power consumption of 100 mW at
3.125 Gbps and 135 mW at 6.375 Gbps per channel
■ 72,600 to 813,050 equivalent LEs per device
■ 7,370 to 33,294 Kb of enhanced TriMatrix memory consisting of three RAM block
sizes to implement true dual-port memory and FIFO buffers
■ High-speed digital signal processing (DSP) blocks configurable as 9 x 9-bit,
12 x 12-bit, 18 x 18-bit, and 36 x 36-bit full-precision multipliers at up to 600 MHz
■ Up to 16 global clocks (GCLK), 88 regional clocks (RCLK), and 132 periphery
clocks (PCLK) per device
■ Programmable power technology that minimizes power while maximizing device
performance
■ Up to 1,120 user I/O pins arranged in 24 modular I/O banks that support a wide
range of single-ended and differential I/O standards
■ Support for high-speed external memory interfaces including DDR, DDR2,
DDR3 SDRAM, RLDRAM II, QDR II, and QDR II+ SRAM on up to 24 modular
I/O banks
■ High-speed LVDS I/O support with serializer/deserializer (SERDES), dynamic
phase alignment (DPA), and soft-CDR circuitry at data rates up to 1.6 Gbps
■ Support for source-synchronous bus standards, including SGMII, GbE, SPI-4
Phase 2 (POS-PHY Level 4), SFI-4.1, XSBI, UTOPIA IV, NPSI, and CSIX-L1
■ Pinouts for Stratix IV E devices designed to allow migration of designs from
Stratix III to Stratix IV E with minimal PCB impact
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深圳斯普仑科技有限公司
Shenzhen Spring Technology Co.,Ltd
地址：深圳市福田区振华路122号海外装饰大厦A座211室
Shenzhen futian district zhenhua road 122 overseas decoration building, room 211, block A, 518031
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