参数资料
| 型号： | SW06GSZ-REEL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 8/12页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH QUAD SPST 16SOIC |
| 标准包装： | 1,000 |
| 功能： | 开关 |
| 电路： | 4 x SPST - NC/NO |
| 导通状态电阻： | 150 欧姆 |
| 电流 - 电源： | 6mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 16-SOIC W |
| 包装： | 带卷 (TR) |
SW06
REV. A
–5–
ORDERING GUIDE
Temperature
Package
Model
Range
Description
Option
SW06BQ
–55
°C to +125°C
Cerdip
Q-16
SW06BRC
–55
°C to +125°C
LCC
E-20A
SW06FQ
–40
°C to +85°C
Cerdip
Q-16
SW06GP
–40
°C to +85°C
Plastic DIP
N-16
SW06GS
–40
°C to +85°C
SOL
R-16
TRUTH TABLE
Switch State
Disable
Logic
Channels
Input
1 & 2
3 & 4
0
X
OFF
1 or NC
0
OFF
ON
1 or NC
1
ON
OFF
ABSOLUTE MAXIMUM RATINGS
1
Operating Temperature Range
SW06BQ, BRC . . . . . . . . . . . . . . . . . . . –55
°C to +125°C
SW06FQ . . . . . . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
SW06GP, GS . . . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300
°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . +150
°C
V+ Supply to V– Supply . . . . . . . . . . . . . . . . . . . . . . . +36 V
V+ Supply to Ground . . . . . . . . . . . . . . . . . . . . . . . . . +36 V
Logic Input Voltage . . . . . . . . . . .
(–4 V or V–) to V+ Supply
Analog Input Voltage Range
Continuous . . . . . . . . . . . . . V– Supply to V+ Supply +20 V
Maximum Current Through
Any Pin Including Switch . . . . . . . . . . . . . . . . . . . . . 30 mA
Package Type
JA
2
JC
Units
16-Pin Hermetic DIP (Q)
100
16
°C/W
16-Pin Plastic DIP (P)
82
39
°C/W
20-Contact LCC (RC)
98
38
°C/W
16-Pin SOL (S)
98
30
°C/W
NOTES
1Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2
θ
JA is specified for worst case mounting conditions, i.e., θJA is specified for device
in socket for Cerdip, P-DIP, and LCC packages;
θ
JA is specified for device soldered
to printed circuit board for SO package.
DICE CHARACTERISTICS
Die Size 0.101
× 0.097 inch, 9797 sq. mils
(2.565
× 2.464 mm, 6320 sq. mm)
PIN CONNECTIONS
16-Pin DIP (Q or P-Suffix)
16-Pin SOL (S-Suffix)
SW06BRC/883
LCC Package
(RC-Suffix)
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