参数资料
型号: SY10EL15ZI
厂商: Micrel Inc
文件页数: 5/5页
文件大小: 0K
描述: IC CLOCK BUFFER MUX 2:4 16-SOIC
标准包装: 48
系列: 100EL, Precision Edge®
类型: 扇出缓冲器(分配),多路复用器
电路数: 1
比率 - 输入:输出: 2:4
差分 - 输入:输出: 是/是
输入: ECL,PECL
输出: ECL,PECL
电源电压: 4.75 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.154",3.90mm 宽)
供应商设备封装: 16-SOIC
包装: 管件
5
Precision Edge
SY89321L
Micrel, Inc.
M9999-060208
hbwhelp@micrel.com or (408) 955-1690
MICREL, INC.
2180 FORTUNE DRIVE
SAN JOSE, CA 95131
USA
TEL
+ 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
2006 Micrel, Incorporated.
8 LEAD ULTRA-SMALL EPAD-
MicroLeadFrame (MLF-8)
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heavy Copper Plane
VEE
Heat Dissipation
PCB Thermal Consideration for 8-Pin MLF Package
Package Notes:
Note 1.
Package meets Level 2 qualification.
Note 2.
All parts are dry-packaged before shipment.
Note 3.
Exposed pads must be soldered to a ground for proper thermal management.
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SY10EL15ZI TR 功能描述:IC CLOCK BUFFER MUX 2:4 16-SOIC RoHS:否 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器,驱动器 系列:100EL, Precision Edge® 标准包装:1 系列:HiPerClockS™ 类型:扇出缓冲器(分配),多路复用器 电路数:1 比率 - 输入:输出:2:18 差分 - 输入:输出:是/无 输入:CML,LVCMOS,LVPECL,LVTTL,SSTL 输出:LVCMOS,LVTTL 频率 - 最大:250MHz 电源电压:2.375 V ~ 3.465 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:32-LQFP 供应商设备封装:32-TQFP(7x7) 包装:- 其它名称:800-1923-6
SY10EL16VAKC 功能描述:IC RCVR DIFF 5V/3.3V 8-MSOP RoHS:否 类别:集成电路 (IC) >> 逻辑 - 专用逻辑 系列:10EL 产品变化通告:Product Discontinuation 25/Apr/2012 标准包装:1,500 系列:74SSTV 逻辑类型:DDR 的寄存缓冲器 电源电压:2.3 V ~ 2.7 V 位数:14 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:48-TFSOP(0.240",6.10mm 宽) 供应商设备封装:48-TSSOP 包装:带卷 (TR)
SY10EL16VAKG 功能描述:IC RCVR DIFF 3.3/5V 8-MSOP RoHS:是 类别:集成电路 (IC) >> 逻辑 - 专用逻辑 系列:10EL 产品变化通告:Product Discontinuation 25/Apr/2012 标准包装:1,500 系列:74SSTV 逻辑类型:DDR 的寄存缓冲器 电源电压:2.3 V ~ 2.7 V 位数:14 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:48-TFSOP(0.240",6.10mm 宽) 供应商设备封装:48-TSSOP 包装:带卷 (TR)
SY10EL16VAKG TR 功能描述:IC RCVR DIFF 3.3/5V 8MSOP RoHS:是 类别:集成电路 (IC) >> 逻辑 - 专用逻辑 系列:10EL 产品变化通告:Product Discontinuation 25/Apr/2012 标准包装:1,500 系列:74SSTV 逻辑类型:DDR 的寄存缓冲器 电源电压:2.3 V ~ 2.7 V 位数:14 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:48-TFSOP(0.240",6.10mm 宽) 供应商设备封装:48-TSSOP 包装:带卷 (TR)
SY10EL16VAKI 功能描述:IC RCVR DIFF 5V/3.3V 8-MSOP RoHS:否 类别:集成电路 (IC) >> 逻辑 - 专用逻辑 系列:10EL 产品变化通告:Product Discontinuation 25/Apr/2012 标准包装:1,500 系列:74SSTV 逻辑类型:DDR 的寄存缓冲器 电源电压:2.3 V ~ 2.7 V 位数:14 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:48-TFSOP(0.240",6.10mm 宽) 供应商设备封装:48-TSSOP 包装:带卷 (TR)