参数资料
型号: SY10EP32VKG TR
厂商: Micrel Inc
文件页数: 3/9页
文件大小: 0K
描述: IC DIVIDER /2 3.3/5V 8-MSOP
标准包装: 1,000
系列: 10EP
逻辑类型: 除以 2
方向:
元件数: 1
每个元件的位元数: 1
复位: 异步
计数速率: 4GHz
触发器类型: 正,负
电源电压: 3 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
供应商设备封装: 8-MSOP
包装: 带卷 (TR)
其它名称: SY10EP32VKGTR
SY10EP32VKGTR-ND
3
Precision Edge
SY10EP32V
SY100EP32V
Micrel, Inc.
M9999-111605
hbwhelp@micrel.com or (408) 955-1690
TA = –40°CTA = +25°CTA = +85°C
Symbol
Parameter
Min.
Typ.
Max.
Min.
Typ.
Max.
Min.
Typ.
Max.
Unit
IEE
Power Supply Current
30
37
30
37
30
37
mA
VOH
Output HIGH Voltage(3)
2165
2290
2415
2230
2355
2480
2290
2415
2540
mV
VOL
Output LOW Voltage(3)
1365
1490
1615
1430
1555
1680
1490
1615
1740
mV
VIH
Input HIGH Voltage
2090
2415
2155
2480
2215
2540
mV
(Single-Ended)
VIL
Input LOW Voltage
1365
1690
1430
1755
1490
1815
mV
(Single-Ended)
VBB
Output Voltage
1790
1890
1990
1855
1955
2055
1915
2015
2115
mV
VIHCMR
Input HIGH Voltage(4)
Common Mode Range
2.0
V
CC
2.0
V
CC
2.0
V
CC
V
(Differential)
IIH
Input HIGH Current
150
150
150
A
IIL
Input LOW Current
CLK
0.5
0.5
0.5
A
/CLK
–150
–150
–150
Note 1.
10EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit
is in a test socket or mounted on a printed circuit board and traverse airflow greater than 500lfpm is maintained.
Note 2.
Input and output parameters vary 1:1 with V
CC.
Note 3.
All loading with 50 to VCC –2.0V.
Note 4.
The V
IHCMR range is referenced to the most positive side of the differential input signal.
(10EP) LVPECL DC ELECTRICAL CHARACTERISTICS(1)
V
CC = 3.3V ±10%; VEE = 0V
(2)
Symbol
Rating
Value
Unit
VCC — VEE
Power Supply Voltage
+6.0
V
VIN
Input Voltage (VCC = 0V, VIN not more negative than VEE)
–6.0 to 0
V
Input Voltage (VEE = 0V, VIN not more positive than VCC)
+6.0 to 0
V
IOUT
Output Current
–Continuous
50
mA
–Surge
100
IBB
VBB Sink/Source Current
(2)
±0.5
mA
TA
Operating Temperature Range
–40 to +85
°C
TSTORE
Storage Temperature Range
–65 to +150
°C
TLEAD
Lead Temperature (soldering, 20 sec.)
+260
°C
θJA
Package Thermal Resistance
–Still Air
SOIC
160
°C/W
(Junction-to-Ambient)
–Still Air
MSOP
206
°C/W
–multi-layer PCB
θJC
Package Thermal Resistance
SOIC
39
°C/W
(Junction-to-Case)
MSOP
39
°C/W
Note 1.
Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng conditions
for extended periods may affect device reliability.
Note 2.
Due to the limited drive capability, the VBB reference should only be used for inputs from the same packge device (i.e., do not sue for other
devices).
ABSOLUTE MAXIMUM RATINGS(1)
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