参数资料
| 型号： | SY56017RMG TR |
| 厂商： | Micrel Inc |
| 文件页数： | 4/4页 |
| 文件大小： | 0K |
| 描述： | IC CLOCK MUX 2:1 4.5GHZ 16-MLF |
| 标准包装： | 1,000 |
| 系列： | Precision Edge® |
| 类型： | 多路复用器 |
| 电路数： | 1 |
| 比率 - 输入:输出： | 2:1 |
| 差分 - 输入:输出： | 是/是 |
| 输入： | CML，LVDS，LVPECL |
| 输出： | CML |
| 频率 - 最大： | 4.5GHz |
| 电源电压： | 2.375 V ~ 2.625 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VFQFN 裸露焊盘，16-MLF? |
| 供应商设备封装： | 16-MLF?（3x3） |
| 包装： | 带卷 (TR) |
Micrel, Inc.
SY56017R
July 2008
4
M9999-070308-A
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings
(1)
Supply Voltage (VCC) ............................... –0.5V to +3.0V
Supply Voltage (VCCO) ............................. –0.5V to +3.0V
VCC - VCCO ...............................................................<1.8V
VCCO - VCC ...............................................................<0.5V
Input Voltage (VIN) .......................................–0.5V to VCC
CML Output Voltage (VOUT) ......................... 0.6V to 3.0V
Current (VT)
Source or sink on VT pin .............................±100mA
Input Current
Source or sink Current on (IN, /IN) ................±50mA
Maximum operating Junction Temperature .......... 125°C
Lead Temperature (soldering, 20sec.) .................. 260°C
Storage Temperature (Ts) ....................–65°C to +150°C
Operating Ratings
(2)
Supply Voltage (VCC) ..........................2.375V to 2.625V
(VCCO)……………..……1.14V to
2.625V
Ambient Temperature (TA) ................... –40°C to +85°C
Package Thermal Resistance
(3)
QFN
Still-air (
θ
JA) ............................................ 75°C/W
Junction-to-board (
ψ
JB) ......................... 33°C/W
DC Electrical Characteristics
(4)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply Voltage Range
VCC
VCCO
2.375
1.14
1.7
2.375
2.5
1.2
1.8
2.5
2.625
1.26
1.9
2.625
V
ICC
Power Supply Current
Max. VCC
55
80
mA
ICCO
Power Supply Current
No Load. VCCO
16
21
mA
RIN
Input Resistance
(IN-to-VT, /IN-to-VT )
45
50
55
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
VIH
Input HIGH Voltage
(IN, /IN)
IN, /IN
1.42
VCC
V
VIL
Input LOW Voltage
(IN, /IN)
IN, /IN
1.22V = 1.7-0.475
1.22
VIH–0.2
V
VIN
Input Voltage Swing
(IN, /IN)
see Figure 3a, Note 5, applied to
input of transmission line.
0.2
1.0
V
VDIFF_IN
Differential Input Voltage Swing
(|IN - /IN|)
see Figure 3b, Note 5, applied to
input of transmission line.
0.4
2.0
V
VT_IN
Voltage from Input to VT
1.28
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for
extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB.
ψ
JB and θJA
values are determined for a 4-layer board in still-air number, unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. VIN(max) is specified when VT is floating.
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