参数资料
型号: SY58030UMG TR
厂商: Micrel Inc
文件页数: 3/11页
文件大小: 0K
描述: IC MUX DIFF LVPECL 4:1 32-MLF
标准包装: 1,000
系列: SY58
类型: 多路复用器
电路: 1 x 4:1
独立电路: 1
电压电源: 单电源
电源电压: 3 V ~ 3.6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 32-VFQFN 裸露焊盘,32-MLF?
供应商设备封装: 32-MLF?(5x5)
包装: 带卷 (TR)
其它名称: SY58030UMGTR
SY58030UMGTR-ND
11
Precision Edge
SY58030U
Micrel, Inc.
M9999-082707
hbwhelp@micrel.com or (408) 955-1690
MICREL, INC.
2180 FORTUNE DRIVE
SAN JOSE, CA 95131
USA
TEL
+ 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
2005 Micrel, Incorporated.
32-PIN MicroLeadFrame (MLF-32)
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heavy Copper Plane
VEE
Heat Dissipation
PCB Thermal Consideration for 32-Pin MLF Package
(Always solder, or equivalent, the exposed pad to the PCB)
Package Notes:
1. Package meets Level 2 qualification.
2. All parts are dry-packaged before shipment.
3. Exposed pads must be soldered to a ground for proper thermal management.
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