参数资料
型号: SY58037UMI TR
厂商: Micrel Inc
文件页数: 6/11页
文件大小: 0K
描述: IC MUX 8:1 HI SPEED 44-MLF
标准包装: 1,000
系列: SY58
类型: 多路复用器
电路: 1 x 8:1
独立电路: 1
电压电源: 单电源
电源电压: 3 V ~ 3.6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 44-VFQFN 裸露焊盘,44-MLF?
供应商设备封装: 44-MLF?(7x7)
包装: 带卷 (TR)
其它名称: SY58037UMITR
SY58037UMITR-ND
4
Precision Edge
SY58037U
Micrel
Absolute Maximum Ratings(1)
Power Supply Voltage (VCC ) ...................... –0.5V to +4.0V
Input Voltage (VIN) ......................................... –0.5V to VCC
LVPECL Output Current (IOUT)
Continuous ............................................................. 50mA
Surge .................................................................... 100mA
Termination Current(3)
Source or sink current on VT pin ........................ ±100mA
Lead Temperature (soldering, 20 sec.) ..................... 260°C
Storage Temperature Range (TS ) ........... –65°C to +150°C
Operating Ratings(2)
Power Supply Voltage (VCC) ............... +2.375V to +2.625V
............................................................ +3.0V to +3.6V
Ambient Temperature Range (TA) ............. –40°C to +85°C
Package Thermal Resistance(4)
QFN (θJA)
Still-Air .............................................................24°C/W
QFN (ψJB)
Junction-to-board ............................................ 12°C/W
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VCC
Power Supply Voltage
VCC = 2.5V.
2.375
2.5
2.625
V
VCC
V
6
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3
.
3
0
.
3
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3
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3
=
ICC
Power Supply Current
No load, max. VCC
A
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0
2
5
4
1
.
RIN
Input Resistance (IN-to-VT
0
6
0
5
0
4
)
RDIFF_IN
0
2
1
0
1
0
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(IN-to-/IN)
VIH
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CC–1.2
VCC
V
(IN-to-/IN)
VIL
V
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IH–0.1
V
(IN-to-/IN)
VIN
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(IN-to-/IN)
VDIFF_IN
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(IN-to-/IN)
VT_IN
IN to VT (IN-to-/IN)
1.28
V
VREF-AC
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CC–1.3 VCC–1.2 VCC–1.1
V
Notes:
1. Permanent device damage may occur if ratings in the “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and functional
operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability, use for input of the same package only.
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB. ΨJB uses 4-layer
θJA in still-air number unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
DC ELECTRICAL CHARACTERISTICS(5)
TA= –40°C to +85°C, unless otherwise stated.
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