参数资料
型号: SY58600UMG TR
厂商: Micrel Inc
文件页数: 2/10页
文件大小: 0K
描述: IC LINEDRIVER/RCVR CML DIFF 8MLF
标准包装: 1
系列: SY58
逻辑类型: 差分接收器/驱动器
电源电压: 3 V ~ 3.6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-VFDFN 裸露焊盘,8-MLF?
供应商设备封装: 8-MLF?(2x2)
包装: 标准包装
产品目录页面: 1089 (CN2011-ZH PDF)
其它名称: 576-1400-6
10
Precision Edge
SY58600U
Micrel, Inc.
M9999-082707
hbwhelp@micrel.com or (408) 955-1690
8-PIN ULTRA-SMALL EPAD MicroLeadFrame (MLF-8)
Package Notes:
1. Package meets Level 2 qualification.
2. All parts dry-packaged before shipment.
3. Exposed pads must be soldered to a ground for proper thermal management.
MICREL, INC.
2180 FORTUNE DRIVE
SAN JOSE, CA 95131
USA
TEL
+ 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
2005 Micrel, Incorporated.
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heavy Copper Plane
VEE
Heat Dissipation
PCB Thermal Consideration for 8-Pin MLF Package
(Always solder, or equivalent, the exposed pad to the PCB)
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