参数资料
型号: SY58602UMG TR
厂商: Micrel Inc
文件页数: 4/10页
文件大小: 0K
描述: IC LDRVR/RCVR LVPECL 400MV 8MLF
标准包装: 1
系列: SY58
逻辑类型: 差分接收器
电源电压: 3 V ~ 3.6 V
位数: 1
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-VFDFN 裸露焊盘,8-MLF?
供应商设备封装: 8-MLF?(2x2)
包装: 标准包装
产品目录页面: 1089 (CN2011-ZH PDF)
其它名称: 576-1402-6
3
Precision Edge
SY58602U
Micrel, Inc.
M9999-082707
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(1)
Supply Voltage (VCC) .................................. –0.5V to +4.0V
Input Voltage (VIN) ......................................... –0.5V to VCC
LVPECL Output Current (IOUT)
Continuous ............................................................. 50mA
Surge .................................................................... 100mA
Termination Current
Source or Sink Current on VT .................................... ±100mA
Input Current
Source or Sink Current on IN, /IN ........................ ±50mA
Current (VREF)(3)
Source or Sink Current on VREF–AC......................... ±1.5mA
Lead Temperature (soldering, 20 sec.) ................... +260°C
Storage Temperature (TS) ....................... –65°C to +150°C
Operating Ratings(2)
Supply Voltage (VCC) ...................... +2.375V to +2.625V or
............................................................ +3.0V to +3.6V
Ambient Temperature (TA) ......................... –40°C to +85°C
Package Thermal Resistance(4)
QFN (θJA)
Still-Air ............................................................. 93°C/W
QFN (ψJB)
Junction-to-Board ............................................ 32°C/W
TA = –40°C to +85°C, unless otherwise noted.
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ICC
Power Supply Current
No Load, max. VCC, Note 6
48
65
mA
RDIFF_IN
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(IN-to-/IN)
RIN
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(IN-to-VT, /IN-to-VT)
VIH
Input HIGH Voltage
Note 7
VCC –1.6
VCC
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(IN, /IN)
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|IN–, /IN|
VT_IN
In-to-VT
1.28
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(IN, /IN)
VREF–AC
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CC –1.3 VCC –1.2 VCC –1.1
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Notes:
1. Permanent device damage may occur if the ratings in “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and functional
operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability use for input of the same package only.
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. ψJB uses 4-layer
θJA in still-air, unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. Includes current through internal 50 pull-ups.
7. VIH (min) not lower than 1.2V.
DC ELECTRICAL CHARACTERISTICS(5)
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