参数资料
型号: SY58605UMG TR
厂商: Micrel Inc
文件页数: 6/12页
文件大小: 0K
描述: IC CLK BUFFER DVR 1:1 3GHZ 8-MLF
标准包装: 1
系列: Precision Edge®
类型: 缓冲器/驱动器
电路数: 1
比率 - 输入:输出: 1:1
差分 - 输入:输出: 是/是
输入: CML,LVDS,LVPECL
输出: LVDS
频率 - 最大: 3GHz
电源电压: 2.375 V ~ 2.625 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-VFDFN 裸露焊盘,8-MLF?
供应商设备封装: 8-MLF?(2x2)
包装: 标准包装
产品目录页面: 1089 (CN2011-ZH PDF)
其它名称: 576-1596-6
Micrel, Inc.
SY58605U
August 2007
3
M9999-082907-B
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings
(1)
Supply Voltage (VCC) ............................... –0.5V to +4.0V
Input Voltage (VIN) ............................ –0.5V to VCC +0.3V
LVDS Output Current (IOUT)..................................±10mA
Input Current
Source or Sink Current on (IN, /IN) ...............±50mA
Current (VREF)
Source or sink current on VREF-AC
(4) ..............±1.5mA
Maximum operating Junction Temperature .......... 125°C
Lead Temperature (soldering, 20sec.) .................. 260°C
Storage Temperature (Ts) ....................–65°C to +150°C
Operating Ratings
(2)
Supply Voltage (VIN) ...................... +2.375V to +2.625V
Ambient Temperature (TA) ................... –40°C to +85°C
Package Thermal Resistance
(3)
DFN
Still-air (
θ
JA) ............................................ 93°C/W
Junction-to-board (
ψ
JB) .......................... 56°C/W
DC Electrical Characteristics
(5)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply Voltage Range
2.375
2.5
2.625
V
ICC
Power Supply Current
No load, max. VCC
35
50
mA
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
VIH
Input HIGH Voltage
(IN, /IN)
IN, /IN
1.2
VCC
V
VIL
Input LOW Voltage
(IN, /IN)
IN, /IN
0
VIH–0.1
V
VIN
Input Voltage Swing
(IN, /IN)
see Figure 3a, Note 6
0.1
1.7
V
VDIFF_IN
Differential Input Voltage Swing
(|IN - /IN|)
see Figure 3b
0.2
V
VIN_FSI
Input Voltage Threshold that
Triggers FSI
30
100
mV
VREF-AC
Output Reference Voltage
VCC–1.3
VCC–1.2
VCC–1.1
V
VT_IN
Voltage from Input to VT
1.28
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for
extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB.
ψ
JB and θJA
values are determined for a 4-layer board in still-air number, unless otherwise stated.
4. Due to the limited drive capability, use for input of the same package only.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. VIN (max) is specified when VT is floating.
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