7
Precision Edge
SY89837U
Micrel, Inc.
M9999-060410
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(1)
Supply Voltage (VCC)....................................–0.5V to +4.0V
Input Volage (VIN)............................................–0.5V to VCC
LVPECL Output Current (IOUT)
Continuous............................................................................. 50mA
Surge......................................................................................100mA
Termination Current(3)
Source or sink current on VT...................................... ±100mA
Lead Temperature (soldering, 20 sec.)...................... 260°C
Storage Temperature (TS) ........................ –65°C to +150°C
Operating Ratings(2)
Supply Voltage (VCC)........................... +2.375V to +2.625V
............................................................. +3.0V to +3.6V
Ambient Temperature (TA).......................... –40°C to +85°C
Package Thermal Resistance(4)
QFN (θJA)
Stll-Air.............................................................................. 35°C/W
QFN (ΨJB)
Junction-to-board........................................................ 16°C/W
TA = –40°C to +85°C; unless noted.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply
2.5V nominal
2.375
2.625
V
3.3V nominal
3.0
3.6
V
ICC
Power Supply Current
No load, max. VCC
115
160
mA
RIN
Input Resistance (IN-to-VT)
45
50
55
RDIFF_IN
Differential Input Resistance
90
100
110
(IN-to-/IN)
VIH
Input High Voltage (IN-to-/IN)
1.2
VCC
V
VIL
Input Low Voltage (IN-to-/IN)
0
VIH–0.2
V
VIN
Input Voltage Swing (IN-to-/IN)
See Figure 1a.(6)
0.2
VCC
V
VDIFF_IN
Differential Input Voltage Swing
See Figure 1b.
0.4
V
|IN–/IN|
VIN_LOS
Input Voltage Swing when signal
100
200
mV
is lost
VT_IN
IN-to-VT (IN-to-/IN)
1.8
V
VREF_AC
Output Reference Voltage
VCC–1.3 VCC–1.2 VCC–1.1
V
(VREF-AC)
Notes:
1. Permanent device damage may occur if ratings in the “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and functional
operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability use for input of the same package only.
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. yJB uses a 4-layer
qJA in still air unless otherwise stated.
5. The circuit is designed to meet the DC specications shown in the above table after thermal equilibrium has been established.
6. VIN(max.) is specied when VT is oating.
DC ELECTRICAL CHARACTERISTICS(5)