参数资料
| 型号： | SY88315BLMG |
| 厂商： | Micrel Inc |
| 文件页数： | 5/10页 |
| 文件大小： | 0K |
| 描述： | IC AMP LIMIT CML TTL SIG 16MLF |
| 标准包装： | 100 |
| 类型： | 限幅后置放大器 |
| 应用： | 光纤学网络 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VFQFN 裸露焊盘，16-MLF? |
| 供应商设备封装： | 16-MLF?（3x3） |
| 包装： | 管件 |
Micrel, Inc.
SY89851U
July 2005
M9999-071205
hbwhelp@micrel.com or (408) 955-1690
4
Absolute Maximum Ratings
(1)
Supply Voltage (VCC) ..........................–0.5V to +4.0V
Input Voltage (IN, /IN) .............................–0.5V to VCC
LVPECL Output Current (IOUT)
Continuous ............................................... ±50mA
Surge...................................................... ±100mA
Termination Current
Source or sink current on VT .................. ±100mA
VREF-AC Current
Source or sink current ............................... ±2mA
Input Current
Source or sink current on IN, /IN.............. ±50mA
Lead Temperature (soldering, 20sec.) ...........+260°C
Storage Temperature (Ts)..................–65°C to 150°C
Operating Ratings
(2)
Supply Voltage (VCC).................. +2.375V to +2.625V
......................................................+3.0V to +3.6V
Ambient Temperature (TA)................ –40°C to +85°C
Package Thermal Resistance
(3)
QFN (
θ
JA)
Still-Air ..................................................... 60°C/W
QFN (
ψ
JB)
Junction-to-Board .................................... 33°C/W
DC Electrical Characteristics
(4)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply
2.375
2.5
2.625
V
3.0
3.3
3.6
V
ICC
Power Supply Current
No load, max. VCC
32
45
mA
RIN
Single-Ended Input Resistance
(IN-to-VT)
45
50
55
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
VIH
Input High Voltage
(IN, /IN)
Note 5
VCC –1.6
VCC
V
VIL
Input Low Voltage
(IN, /IN)
0
VIH-0.1
V
VIN
Input Voltage Swing
(IN, /IN)
See Figure 1a.
0.1
1.7
V
VDIFF_IN
Differential Input Voltage Swing
|IN-/IN|
See Figure 1b.
0.2
V
VT_IN
IN-to-VT
(IN, /IN)
1.28
V
VREF-AC
Output Reference Voltage
VCC –1.3
VCC –1.2
VCC –1.1
V
Notes:
1. Permanent device damage may occur if the absolute maximum ratings are exceeded. This is a stress rating only and
functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet.
Exposure to absolute maximum ratings conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the
PCB.
θ
JA and ψJB values are for a 4-layer board in still air, unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been
established.
5. VIH(min) not lower than 1.2V
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