
Micrel, Inc.
SY88347DL
February 2007
4
M9999-021707-B
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings
(1)
Supply Voltage (VCC) .................................. 0V to +4.0V
Input Voltage (DIN, /DIN) ................................... 0 to VCC
Output Current (IOUT)
Continuous.....................................................+50mA
Surge ...........................................................+100mA
/EN Voltage ........................................................ 0 to VCC
VREF Current .......................................-800A to +500A
LOSLVL Voltage.............................................. VREF to VCC
Lead Temperature (soldering, 20sec.) .................. 260°C
Storage Temperature (Ts) .....................-65°C to +150°C
Operating Ratings
(2)
Supply Voltage (VCC)............................+3.0V to +3.6V
Ambient Temperature (TA) ..................–40°C to +85°C
Junction Temperature (TJ) ................–40°C to +125°C
Junction Thermal Resistance
(3)
EPAD-MSOP
θJA (Still-Air) ..............................................38
oC/W
ψJB.............................................................22
oC/W
DC Electrical Characteristics
VCC = 3.0V to 3.6V; RL = 50 to VCC-2V; TA = –40°C to +85°C; typical values at VCC = 3.3V, TA = 25
oC.
Symbol
Parameter
Condition
Min
Typ
Max
Units
ICC
Power Supply Current
No output load
40
60
mA
VLOSLVL
LOSLVL Voltage
VREF
VCC
V
VOH
PECL Output HIGH Voltage
VCC-1.085 VCC-0.955 VCC-0.880
V
VOL
PECL Output LOW Voltage
VCC-1.880 VCC-1.705 VCC-1.555
V
VOFFSET
Differential Output Offset
+120
mV
VREF
Reference Voltage
VCC-1.48
VCC-1.32 VCC-1.16
V
VIHCMR
Input Common Mode Range
GND+2.0
VCC
V
TTL DC Electrical Characteristics
VCC = 3.0V to 3.6V; TA = –40°C to +85°C.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VIH
/EN Input HIGH Voltage
2.0
V
VIL
/EN Input LOW Voltage
0.8
V
IIH
/EN Input HIGH Current
VIN = 2.7V
VIN = VCC
20
100
A
IIL
/EN Input LOW Current
VIN = 0.5V
-300
A
IOH
LOS Output Leakage
VOH = 3.6V
100
uA
VOL
LOS Output LOW Level
IOL = +2mA
0.5
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Thermal performance assumes the use of a 4-layer PCB. Exposed pad must be soldered (or equivalent) to the device’s most negative
potential on the PCB.