参数资料
型号: SY88713VKC TR
厂商: Micrel Inc
文件页数: 4/8页
文件大小: 0K
描述: IC AMP POST PECL 3.3V/5V 10-MSOP
标准包装: 1,000
类型: 限幅后置放大器
应用: 光纤学网络
安装类型: 表面贴装
封装/外壳: 10-TFSOP,10-MSOP(0.118",3.00mm 宽)
供应商设备封装: 10-MSOP
包装: 带卷 (TR)
其它名称: SY88713VKCTR
SY88713VKCTR-ND
Micrel, Inc.
SY89871U
Oct. 1, 2013
4
M9999-010512-F
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings
(1)
Supply Voltage (VCC) .................................... –0.5V to +4.0V
Input Voltage (VIN) .................................. –0.5V to VCC+0.3V
PECL Output Current (IOUT)
Continuous............................................................50mA
Surge ..................................................................100mA
VT Current (IVT) ........................................................100mA
Input Current IN, /IN (IIN) ...........................................50mA
RREF-AC Sink/Source Current (IVREF-AC).........................2mA
Lead Temperature (soldering, 20 sec.) ...................... 260°C
Storage Temperature (TS)........................... –65°C to 150°C
Operating Ratings
(2)
Supply Voltage (VCC).............................. +2.375V to +3.63V
Ambient Temperature (TA) .......................... –40°C to +85°C
Package Thermal Resistance
(3)
QFN (
JA)
Still-Air ............................................................60°C/W
500lfpm ...........................................................54°C/W
QFN (
JB)
Junction-to-board...........................................38°C/W
DC Electrical Characteristics
(4)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply Voltage
2.37
3.60
V
ICC
Power Supply Current
No load, max VCC.
50
75
mA
RIN
Differential Input Resistance, (IN-to-/IN)
90
100
110
Ω
VIH
Input HIGH Voltage, (IN-to-/IN)
0.1
VCC+0.3
V
VIL
Input LOW Voltage, (IN-to-/IN)
–0.3
VIH–0.1
V
VIN
Input Voltage Swing
Note 5
0.1
VCC
V
VDIFF_IN
Differential Input Voltage Swing
Notes 5, 6
0.2
V
|IIN|
Input Current, (IN-to-/IN)
Note 7
45
mA
VREF_AC
Reference Voltage
VCC–1.525
VCC–1.425
VCC–1.325
V
Notes:
1.
Permanent device damage may occur if ratings in the “Absolute Maximum Ratings” sections are exceeded. This is a stress rating only and functional
operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Junction-to-
board resistance assumes exposed pad is soldered (or equivalent) to the device’s most Negative potential on the PCB.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. See “Timing Diagram” for VIN definition. VIN (max.) is specified when VT is floating.
6. See “Typical Operating Characteristics” section for VDIFF definition.
7. Due to the internal termination (see “Input Buffer Structure” section) the input current depends on the applied voltages at IN, /IN and VT inputs. Do not
apply a combination of voltages that causes the input current to exceed the maximum limit.
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