参数资料
型号: SY89546UMG
厂商: Micrel Inc
文件页数: 10/14页
文件大小: 0K
描述: IC MUX 4:1 LVDS DIFF 2.5V 32MLF
标准包装: 60
系列: SY89
类型: 多路复用器
电路: 1 x 4:1
独立电路: 1
电压电源: 单电源
电源电压: 3 V ~ 3.6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 32-VFQFN 裸露焊盘,32-MLF?
供应商设备封装: 32-MLF?(5x5)
包装: 管件
产品目录页面: 1090 (CN2011-ZH PDF)
其它名称: 576-1427
Micrel, Inc.
SY89546U
April 2011
5
M9999-0041911-B
hbwhelp@micrel.com
Absolute Maximum Ratings
(1)
Supply Voltage (Vcc)..................................... –0.5V to +4.0V
Input Voltage (VIN) ....................................................................–0.5V to Vcc
Termination Current
(3)
Source or sink current on VT............................±100mA
Input Current
Source or sink current on VT..............................±50mA
Lead Temperature (soldering, 20sec.)..................... +260°C
Storage Temperature (Ts).........................–65°C to +150°C
Operating Ratings
(2)
Supply Voltage (VCC)............................. 2.375V to 2.625V
Ambient Temperature (TA).......................–40°C to +85°C
Package Thermal Resistance
(4)
MLF (θJA)
Still Air, multi-layer PCB .................................35°C/W
500lfpm, multi-layer PCB................................28°C/W
MLF (ΨJA)
Junction-to-Board ...........................................20°C/W
DC Electrical Characteristics
(5)
-40°C≤ TA ≤ +85°C, unless stated otherwise.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply
2.375
2.5
2.625
V
ICC
Power Supply Current
No Load, Max. VCC
(6)
75
100
mA
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
80
100
120
RIN
Input Resistance
(IN-to-VT, /IN-to-VT)
40
50
60
VIH
Input High Voltage
(IN, /IN)
1.2
VCC
V
VIL
Input Low Voltage
(IN, /IN)
0
VIH-0.1
V
VIN
Input Voltage Swing
(IN, /IN)
Note 7
0.1
VCC
V
VDIFF_IN
Differential Input Voltage Swing
|IN – /IN|
Note 7
0.2
V
IN-to-VT
Note 7
1.8
V
Notes:
1. Permanent device damage may occur if “Absolute Maximum Ratings” are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to “Absolute Maximum Ratings” conditions for
extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability use for input of the same package only.
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential (GND) on the PCB. Ψ
JA uses
4-layer θ
JA in still-air unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. Includes current through internal 50 pull-ups.
7. See “Single-Ended and Differential Swings” section for VIN and VDIFF_IN definition.
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