参数资料
型号: SY89824LHZ
厂商: Micrel Inc
文件页数: 3/7页
文件大小: 0K
描述: IC CLOCK BUFFER MUX 2:22 64-TQFP
标准包装: 160
系列: Precision Edge®
类型: 扇出缓冲器(分配),多路复用器
电路数: 1
比率 - 输入:输出: 2:22
差分 - 输入:输出: 是/是
输入: HSTL,LVPECL
输出: HSTL
电源电压: 3 V ~ 3.6 V
工作温度: 0°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 64-TQFP 裸露焊盘
供应商设备封装: 64-EP-TQFP
包装: 托盘
产品目录页面: 1090 (CN2011-ZH PDF)
其它名称: 576-2565
SY89824LHZ-ND
3
Precision Edge
SY89824L
Micrel, Inc.
M9999-020207
hbwhelp@micrel.com or (408) 955-1690
OE(1)
CLK_SEL
Q0-Q21
/Q0-/Q21
0
LOW
HIGH
0
1
LOW
HIGH
1
0
HSTL_CLK
/HSTL_CLK
1
LVPECL_CLK
/LVPECL_CLK
TRUTH TABLE
NOTE:
1. The OE (output enable) signal is synchronized with the low level of the
HSTL_CLK and LVPECL_CLK signal.
Level
Direction
Signal
HSTL
Input
HSTL_CLK, /HSTL_CLK
HSTL
Output
Q0-Q21, /Q0-/Q21
LVPECL
Input
LVPECL_CLK, /LVPECL_CLK
LVCMOS/LVTTL
Input
CLK_SEL, OE
SIGNAL GROUPS
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
Rating
Value
Unit
VCCI, VCCO
V
CC Pin Potential to Ground Pin
–0.5 to +4.0
V
VIN
Input Voltage
–0.5 to V
CCI
V
IOUT
DC Output Current (Output HIGH)
–50
mA
TLEAD
Lead Temperature (soldering, 20sec.)
260
°C
Tstore
Storage Temperature
–65 to +150
°C
θ
JA
Package Thermal Resistance (Junction-to-Ambient)
With Die attach soldered to GND:
–Still-Air (TQFP)
23
°C/W
–200lfpm (TQFP)
18
°C/W
–500lfpm (TQFP)
15
°C/W
With Die attach NOT soldered to GND:
–Still-Air (TQFP)
44
°C/W
–200lfpm (TQFP)
36
°C/W
–500lfpm (TQFP)
30
°C/W
θ
JC
Package Thermal Resistance
4.3
°C/W
(Junction-to-Case)
NOTE:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data book. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
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