参数资料
型号: SY89873LMI TR
厂商: Micrel Inc
文件页数: 5/11页
文件大小: 0K
描述: IC CLK BUFF DVDR 1:3 2GHZ 16-MLF
标准包装: 1,000
系列: Precision Edge®
类型: 扇出缓冲器(分配),除法器
电路数: 1
比率 - 输入:输出: 1:3
差分 - 输入:输出: 是/是
输入: CML,HSTL,LVDS,LVPECL
输出: LVDS
频率 - 最大: 2GHz
电源电压: 2.97 V ~ 3.63 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-VFQFN 裸露焊盘,16-MLF?
供应商设备封装: 16-MLF?(3x3)
包装: 带卷 (TR)
其它名称: SY89873LMITR
SY89873LMITR-ND
3
Precision Edge
SY89873L
Micrel, Inc.
M9999-082407
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(1)
Supply Voltage (VCC) .................................. –0.5V to +4.0V
Input Voltage (VIN) .................................. –0.5V to VCC+0.3
LVDS Output Current (IOUT) ....................................±10mA
Input Current IN, /IN (IIN) ..........................................±50mA
VREF-AC Input Sink/Source Current (IVREF-AC)(3) ............ ±2mA
Lead Temperature (soldering, 20 sec.) ..................... 260°C
Storage Temperature (TS) ....................... –65°C to +150°C
Operating Ratings(2)
Supply Voltage (VCC) ...................................... +3.3V ±10%
Ambient Temperature (TA) ......................... –40°C to +85°C
Package Thermal Resistance
QFN(θJA)
Still-Air ............................................................. 60°C/W
500 lfpm........................................................... 54°C/W
QFN(ΨJB)(4)
Junction-to-Board ............................................ 38°C/W
TA= –40°C to +85°C; Unless otherwise stated.
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Power Supply Current
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RIN
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VREF-AC
Reference Voltage
Note 9
VCC –1.525 VCC–1.425 VCC–1.325
V
Notes:
1. Permanent device damage may occur if
“Absolute Maximum Ratings” are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to
“Absolute Maximum Ratings” conditions for extended
periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability use for input of the same package only.
4. Junction-to-board resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. Due to the internal termination (see
“Input Buffer Structure” ) the input current depends on the applied voltages at IN, /IN and VT inputs. Do not apply a
combination of voltages that causes the input current to exceed the maximum limit!
7. See
“Timing Diagram” for VIN definition. VIN(max) is specified when VT is floating.
8. See Figures 1c and 1d for VDIFF definition.
9. Operating using VIN is limited to AC-coupled PECL or CML applications only. Connect directly to VT pin.
DC ELECTRICAL CHARACTERISTICS(5)
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