参数资料
型号: SZMMBZ20VAWT1G
厂商: ON Semiconductor
文件页数: 1/5页
文件大小: 0K
描述: TVS ZENER 40W 20V SC-70-3
标准包装: 3,000
电压 - 反向隔离(标准值): 17V
电压 - 击穿: 19V
功率(瓦特): 40W
电极标记: 2 通道阵列 - 单向
安装类型: *
封装/外壳: *
供应商设备封装: *
包装: *
MMBZxxVAWT1G Series,
SZMMBZxxVAWT1G Series
40 Watt Peak Power
Zener Transient Voltage
Suppressors
SC ? 70 Dual Common Anode Zeners
for ESD Protection
These dual monolithic silicon Zener diodes are designed for
applications requiring transient overvoltage protection capability. They
are intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment and other applications. Their dual junction common
http://onsemi.com
SC ? 70
CASE 419
STYLE 4
anode design protects two separate lines using only one package. These
devices are ideal for situations where board space is at a premium.
Features
? SC ? 70 Package Allows Either Two Separate Unidirectional
Configurations or a Single Bidirectional Configuration
?
Working Peak Reverse Voltage Range
CATHODE 1
CATHODE 2
MARKING DIAGRAM
3 ANODE
?
?
?
Standard Zener Breakdown Voltage Range: 15 ? 33 V
Peak Power ? 40 W @ 1.0 ms (Unidirectional),
per Figure 5 Waveform
ESD Rating:
? Class 3B (> 16 kV) per the Human Body Model
1
XX M G
G
?
?
?
?
? Class C (> 400 V) per the Machine Model
Low Leakage < 5.0 m A
Flammability Rating UL 94 V ? 0
AEC ? Q101 Qualified and PPAP Capable ? SZMMBZxxVAWT1G
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
XX = Specific Device Code
M = Date Code
G = Pb ? Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
?
These are Pb ? Free Devices*
Device
Package
Shipping ?
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MMBZxxVAWT1G
SZMMBZxxVAWT1G
SC ? 70
(Pb ? Free)
SC ? 70
(Pb ? Free)
3,000 /
Tape & Reel
3,000 /
Tape & Reel
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260 ? C for 10 Seconds
Package designed for optimal automated board assembly
Small package size for high density applications
Available in 8 mm Tape and Reel
Use the Device Number to order the 7 inch/3,000 unit reel.
*For additional information on our Pb ? Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
? Semiconductor Components Industries, LLC, 2012
January, 2012 ? Rev. 4
1
Publication Order Number:
MMBZ27VAW/D
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