参数资料
型号: SZNUP4301MR6T1G
厂商: ON Semiconductor
文件页数: 1/4页
文件大小: 0K
描述: IC TVS DIODE ARRAY 70V 6-TSOP
标准包装: 3,000
电压 - 击穿: 70V
电极标记: 4 通道阵列 - 双向
安装类型: *
封装/外壳: *
供应商设备封装: *
包装: *
NUP4301MR6T1G,
SZNUP4301MR6T1G
Low Capacitance Diode
Array for ESD Protection in
Four Data Lines
SZ/NUP4301MR6T1G is a micro ? integrated device designed to
provide protection for sensitive components from possible harmful
electrical transients; for example, ESD (electrostatic discharge).
Features
? Low Capacitance (1.5 pf Maximum Between I/O Lines)
? Single Package Integration Design
? Provides ESD Protection for JEDEC Standards JESD22
Machine Model = Class C
Human Body Model = Class 3B
? Protection for IEC61000 ? 4 ? 2 (Level 4)
8.0 kV (Contact)
15 kV (Air)
http://onsemi.com
SC ? 74
CASE 318F
PLASTIC
PIN CONFIGURATION
AND SCHEMATIC
I/O 1 6 I/O
?
?
?
?
Ensures Data Line Speed and Integrity
Fewer Components and Less Board Space
Direct the Transient to Either Positive Side or to the Ground
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC ? Q101 Qualified and
V N 2
1/O 3
5 V P
4 I/O
?
PPAP Capable
This is a Pb ? Free Device*
MARKING DIAGRAM
Applications
?
?
?
?
?
?
?
?
USB 1.1 and 2.0 Data Line Protection
T1/E1 Secondary IC Protection
T3/E3 Secondary IC Protection
HDSL, IDSL Secondary IC Protection
Video Line Protection
Microcontroller Input Protection
Base Stations
I 2 C Bus Protection
64M G
G
1
64 = Device Code
M = Date Code*
G = Pb ? Free Package
(Note: Microdot may be in either location.
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
NUP4301MR6T1G
SZNUP4301MR6T1G
Package
SC ? 74
(Pb ? Free)
SC ? 74
(Pb ? Free)
Shipping ?
3,000 /
Tape & Reel
3,000 /
Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb ? Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
? Semiconductor Components Industries, LLC, 2012
February, 2012 ? Rev. 6
1
Publication Order Number:
NUP4301MR6T1/D
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