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参数资料
| 型号： | T494B156M010AT |
| 厂商： | Kemet |
| 文件页数： | 15/24页 |
| 文件大小： | 0K |
| 描述： | CAP TANT 15UF 10V 20% 1411 |
| 产品培训模块： | Capacitor Basics- Typical Uses for Capacitors |
| 标准包装： | 1 |
| 系列： | T494 |
| 电容： | 15µF |
| 电压 - 额定： | 10V |
| 容差： | ±20% |
| ESR（等效串联电阻）： | 700 毫欧 |
| 类型： | 模制 |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 1411（3528 公制） |
| 尺寸/尺寸： | 0.138" L x 0.110" W（3.50mm x 2.80mm） |
| 高度 - 座高（最大）： | 0.083"（2.10mm） |
| 制造商尺寸代码： | B |
| 特点： | 通用 |
| 包装： | 标准包装 |
| 其它名称： | 399-8448-6 |
Tantalum Surface Mount Capacitors – Standard Tantalum
T491 Industrial Grade MnO 2 Series
Soldering Process
Peak Temperature (T P )
20 seconds maximum
30 seconds maximum
6 minutes maximum
8 minutes maximum
T P
T L
KEMET’s families of surface mount capacitors are compatible
with wave (single or dual), convection, IR, or vapor phase reflow
techniques. Preheating of these components is recommended
to avoid extreme thermal stress. KEMET's recommended
profile conditions for convection and IR reflow reflect the profile
conditions of the IPC/J–STD–020D standard for moisture
sensitivity testing. The devices can safely withstand a maximum
of three reflow passes at these conditions.
Note that although the X/7343–43 case size can withstand wave
soldering, the tall profile (4.3 mm maximum) dictates care in wave
process development.
Hand soldering should be performed with care due to the difficulty
in process control. If performed, care should be taken to avoid
contact of the soldering iron to the molded case. The iron should
be used to heat the solder pad, applying solder between the pad
and the termination, until reflow occurs. Once reflow occurs, the
iron should be removed immediately. “Wiping” the edges of a chip
and heating the top surface is not recommended.
During typical reflow operations, a slight darkening of the gold-
colored epoxy may be observed. This slight darkening is normal
and not harmful to the product. Marking permanency is not
affected by this change.
Profile Feature SnPb Assembly Pb-Free Assembly
Preheat/Soak
Temperature Minimum (T Smin ) 100°C 150°C
Temperature Maximum (T Smax ) 150°C 200°C
Time (t s ) from T smin to T smax ) 60 – 120 seconds 60 – 120 seconds
Ramp-up Rate (T L to T P ) 3°C/seconds maximum 3°C/seconds maximum
Liquidous Temperature (T L ) 183°C 217°C
Time Above Liquidous (t L ) 60 – 150 seconds 60 – 150 seconds
220°C* 250°C*
235°C** 260°C**
Time within 5°C of Maximum
Peak Temperature (t P )
Ramp-down Rate (T P to T L ) 6°C/seconds maximum 6°C/seconds maximum
Time 25°C to Peak
Temperature
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
*Case Size D, E, P, Y, and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z
Maximum Ramp Up Rate = 3oC/seconds t P
Maximum Ramp Down Rate = 6oC/seconds
t L
T smax
T smin
t S
25
25oC to Peak
Time
Construction
Silver Paint
MnO 2 /Ta 2 O 5 /Ta
Silver Adhesive
Washer
Leadframe
(-Cathode)
Carbon
Tantalum Wire
Weld
Leadframe
(+Anode)
? KEMET Electronics Corporation ? P.O. Box 5928 ? Greenville, SC 29606 (864) 963-6300 ? www.kemet.com
T2005_T491 ? 10/8/2013
15
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相关代理商/技术参数 |
参数描述 |
|---|---|
| T494B156M010AT2478 | 制造商:KEMET Corporation 功能描述:15.0UF 10.0V |
| T494B156M016AS | 制造商:KEMET 制造商全称:Kemet Corporation 功能描述:SOLID TANTALUM CHIP CAPACITORS(T494 SERIES - Low ESR, Industrial Grade) |
| T494B156M016AT | 功能描述:钽质电容器-固体SMD 16volts 15uF 20% RoHS:否 制造商:AVX 电容:100 uF 电压额定值:20 V ESR: 容差:10 % 外壳代码 - in:2917 外壳代码 - mm:7343 高度:4.1 mm 制造商库存号:E Case 工作温度范围:- 55 C to + 125 C 系列:TBM 产品:Tantalum Solid Low ESR Commercial Grade 封装:Bulk |
| T494B156M016AT2478 | 制造商:KEMET Corporation 功能描述:15.0UF 16.0V |
| T494B156M025AH | 功能描述:钽质电容器-固体SMD 15.0UF 25.0V RoHS:否 制造商:AVX 电容:100 uF 电压额定值:20 V ESR: 容差:10 % 外壳代码 - in:2917 外壳代码 - mm:7343 高度:4.1 mm 制造商库存号:E Case 工作温度范围:- 55 C to + 125 C 系列:TBM 产品:Tantalum Solid Low ESR Commercial Grade 封装:Bulk |
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