参数资料
型号: T494B226M010AT
厂商: Kemet
文件页数: 14/24页
文件大小: 0K
描述: CAP TANT 22UF 10V 20% 1411
产品培训模块: Capacitor Basics- Typical Uses for Capacitors
标准包装: 1
系列: T494
电容: 22µF
电压 - 额定: 10V
容差: ±20%
ESR(等效串联电阻): 700 毫欧
类型: 模制
工作温度: -55°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 1411(3528 公制)
尺寸/尺寸: 0.138" L x 0.110" W(3.50mm x 2.80mm)
高度 - 座高(最大): 0.083"(2.10mm)
制造商尺寸代码: B
特点: 通用
包装: 标准包装
其它名称: 399-8451-6
Tantalum Surface Mount Capacitors – Standard Tantalum
T491 Industrial Grade MnO 2 Series
Reverse Voltage
Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The
positive terminal is identified on the capacitor body by a stripe plus in some cases a beveled edge. A small degree of transient reverse 
voltage is permissible for short periods per the table. The capacitors should not be operated continuously in reverse mode, even within
these limits.
Temperature
25°C
85°C
125°C
Permissible Transient Reverse Voltage
15% of Rated Voltage
5% of Rated Voltage
1% of Rated Voltage
Table 2 – Land Dimensions/Courtyard
KEMET
Metric
Size
Code
Density Level A:
Maximum (Most) Land
Protrusion (mm)
Density Level B:
Median (Nominal) Land
Protrusion (mm)
Density Level C:
Minimum (Least) Land
Protrusion (mm)
Case
A
B
C
D
L
M
H
E 1
Q
R 2
S 2
T
U
V
W
X 1
Y 1
EIA
3216 –18
3528 –21
6032–25
7343 –31
6032-19
3528-15
7360-20
7360 –38
7343-12
2012-12
3216 –12
3528 –12
6032–15
7343 –20
7343 –15
7343 –43
7343 –40
W
1.35
2.35
2.35
2.55
2.35
2.35
4.25
4.25
2.55
1.05
1.35
2.35
2.35
2.55
2.55
2.55
2.55
L
2.20
2.21
2.77
2.77
2.77
2.20
2.77
2.77
2.77
1.83
2.20
2.20
2.77
2.77
2.77
2.77
2.77
S
0.62
0.92
2.37
3.67
2.37
0.92
3.67
3.67
3.67
0.15
0.62
0.92
2.37
3.67
3.67
3.67
3.67
V1
6.02
6.32
8.92
10.22
8.92
6.32
10.22
10.22
10.22
4.82
6.02
6.32
8.92
10.22
10.22
10.22
10.22
V2
2.80
4.00
4.50
5.60
4.50
4.00
7.30
7.30
5.60
2.50
2.80
4.00
4.50
5.60
5.60
5.60
5.60
W
1.23
2.23
2.23
2.43
2.23
2.23
4.13
4.13
2.43
0.93
1.23
2.23
2.23
2.43
2.43
2.43
2.43
L
1.80
1.80
2.37
2.37
2.37
1.80
2.37
2.37
2.37
1.50
1.80
1.80
2.37
2.37
2.37
2.37
2.37
S
0.82
1.12
2.57
3.87
2.57
1.12
3.87
3.87
3.87
0.22
0.82
1.12
2.57
3.87
3.87
3.87
3.87
V1
4.92
5.22
7.82
9.12
7.82
5.22
9.12
9.12
9.12
3.72
4.92
5.22
7.82
9.12
9.12
9.12
9.12
V2
2.30
3.50
4.00
5.10
4.00
3.50
6.80
6.80
5.10
2.00
2.30
3.50
4.00
5.10
5.10
5.10
5.10
W
1.13
2.13
2.13
2.33
2.13
2.13
4.03
4.03
2.33
0.83
1.13
2.13
2.13
2.33
2.33
2.33
2.33
L
1.42
1.42
1.99
1.99
1.99
1.42
1.99
1.99
1.99
1.12
1.42
1.42
1.99
1.99
1.99
1.99
1.99
S
0.98
1.28
2.73
4.03
2.73
1.28
4.03
4.03
4.03
0.38
0.98
1.28
2.73
4.03
4.03
4.03
4.03
V1
4.06
4.36
6.96
8.26
6.96
4.36
8.26
8.26
8.26
2.86
4.06
4.36
6.96
8.26
8.26
8.26
8.26
V2
2.04
3.24
3.74
4.84
3.74
3.24
6.54
6.54
4.84
1.74
2.04
3.24
3.74
4.84
4.84
4.84
4.84
Land pattern geometry is too small for silkscreen outline.
Density Level A: For low-density product applications. Recommended for wave solder applications and
provides a wider process window for reflow solder processes.
Density Level B: For products with a moderate level of component density. Provides a robust solder
attachment condition for reflow solder processes.
Density Level C: For high component desity product applications. Before adapting the minimum land
pattern variations the user should perform qualification testing based on the conditions outlined in IPC
standard 7351 (IPC –7351).
1 Height of these chips may create problems in wave soldering.
2
? KEMET Electronics Corporation ? P.O. Box 5928 ? Greenville, SC 29606 (864) 963-6300 ? www.kemet.com
T2005_T491 ? 10/8/2013
14
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