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| 型号： | T521V686M016ATE090 |
| 厂商： | Kemet |
| 文件页数： | 9/17页 |
| 文件大小： | 0K |
| 描述： | CAP TANT 68UF 16V 20% 2917 |
| 产品培训模块： | Capacitor Basics- Typical Uses for Capacitors |
| 产品目录绘图： | T49, T5(1,2,3) Series Markings T49x, T5xx Series_C, D, E, L, U, V, W, X, Y-side2 T49x, T5xx Series_V, W, X, Y-bottom T49x, T5xx Series_V-side1 |
| 标准包装： | 1 |
| 系列： | KO Cap T521 |
| 电容： | 68µF |
| 电压 - 额定： | 16V |
| 容差： | ±20% |
| ESR（等效串联电阻）： | 90 毫欧 |
| 类型： | 模制 |
| 工作温度： | -55°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 2917（7343 公制） |
| 尺寸/尺寸： | 0.287" L x 0.169" W（7.30mm x 4.30mm） |
| 高度 - 座高（最大）： | 0.079"（2.00mm） |
| 制造商尺寸代码： | V |
| 特点： | 聚合物 |
| 包装： | 标准包装 |
| 其它名称： | 399-5936-6 |
KEMET Organic Capacitor (KO-CAP) – T521 High Voltage Polymer Tantalum
Soldering Process
KEMET’s families of surface mount capacitors are compatible
with wave (single or dual), convection, IR, or vapor phase reflow
techniques. Preheating of these components is recommended
to avoid extreme thermal stress. KEMET's recommended
profile conditions for convection and IR reflow reflect the profile
conditions of the IPC/J –STD –020D standard for moisture
sensitivity testing. The devices can safely withstand a maximum
of three reflow passes at these conditions.
Profile Feature
Preheat/Soak
Temperature Minimum (T Smin )
Temperature Maximum (T Smax )
Time (t s ) from T smin to T smax )
Ramp-up Rate (T L to T P )
Liquidous Temperature (T L )
Time Above Liquidous (t L )
SnPb Assembly
100°C
150°C
60 – 120 seconds
3°C/seconds maximum
183°C
60 – 150 seconds
Pb-Free Assembly
150°C
200°C
60 – 120 seconds
3°C/seconds maximum
217°C
60 – 150 seconds
Peak Temperature (T P )
20 seconds maximum
30 seconds maximum
6 minutes maximum
8 minutes maximum
T P
T L
Please note that although the X/7343 –43 case size can withstand
wave soldering, the tall profile (4.3 mm maximum) dictates care in
wave process development.
Hand soldering should be performed with care due to the difficulty
in process control. If performed, care should be taken to avoid
contact of the soldering iron to the molded case. The iron should
be used to heat the solder pad, applying solder between the pad
and the termination, until reflow occurs. Once reflow occurs, the
iron should be removed immediately. “Wiping” the edges of a chip
and heating the top surface is not recommended.
During typical reflow operations, a slight darkening of the gold-
colored epoxy may be observed. This slight darkening is normal
and not harmful to the product. Marking permanency is not
affected by this change.
220°C* 250°C*
235°C** 260°C**
Time within 5°C of Maximum
Peak Temperature (t P )
Ramp-down Rate (T P to T L ) 6°C/seconds maximum 6°C/seconds maximum
Time 25°C to Peak
Temperature
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
*Case Size D, E, P, Y, and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z
Maximum Ramp Up Rate = 3oC/seconds t P
Maximum Ramp Down Rate = 6oC/seconds
t L
T smax
T smin
t S
25
25oC to Peak
Time
Construction
Polymer /Ta 2 O 5 /Ta
Silver Paint
Leadframe
(-Cathode)
Carbon
Tantalum Wire
Silver Adhesive
Weld
Washer
Leadframe
(+Anode)
? KEMET Electronics Corporation ? P.O. Box 5928 ? Greenville, SC 29606 (864) 963-6300 ? www.kemet.com
T2016_T521 ? 12/4/2013
9
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