参数资料
型号: T835-800B
厂商: STMICROELECTRONICS
元件分类: 晶闸管
英文描述: 800 V, 8 A, SNUBBERLESS TRIAC
封装: DPAK-3
文件页数: 8/12页
文件大小: 145K
代理商: T835-800B
BTA08, BTB08 and T8 Series
Characteristics
Doc ID 7472 Rev 7
5/12
Figure 7.
Non-repetitive surge peak on-state
current for a sinusoidal
Figure 8.
Relative variation of gate trigger
current
0.01
0.10
1.00
10.00
10
100
1000
I
(A), I t (A s)
TSM
22
t (ms)
p
T initial=25°C
j
ITSM
dI/dt limitation:
50A/s
I t
2
pulse with width t < 10 ms and corresponding value of I t
p
2
360°
α
-40
-20
0
20
40
60
80
100
120
140
0.0
0.5
1.0
1.5
2.0
2.5
T (°C)
j
I,I ,I [T ] /
GTHL
j
I
,I ,I [T =25°C]
GTHL
j
IGT
IH & IL
holding current and latching current
versus junction temperature (typical values)
Figure 9.
Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
Figure 10.
Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
0.1
1.0
10.0
100.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
(dV/dt)c (V/s)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
TW
T835/CW/BW
T810/SW
Snubberless and Logic level types
0.1
1.0
10.0
100.0
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
(dV/dt)c (V/s)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
C
B
Standard types
Figure 11.
Relative variation of critical rate of
decrease of main current versus
junction temperature
Figure 12.
DPAK and D2PAK thermal resistance
junction to ambient versus copper
surface under tab
0
25
50
75
100
125
0
1
2
3
4
5
6
(dI/dt)c [T ] /
pecified]
j
(dI/dt)c [T s
j
T (°C)
j
0
4
8
1216202428323640
0
10
20
30
40
50
60
70
80
90
100
S(cm)
R
(°C/W)
th(j-a)
DPAK
2
DPAK
printed circuit board FR4, copper thickness: 35 m
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相关代理商/技术参数
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