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| 型号： | TAS5100AIDAPRG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 30 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32 |
| 封装： | PLASTIC, HTSSOP-32 |
| 文件页数： | 4/15页 |
| 文件大小： | 189K |
| 代理商： | TAS5100AIDAPRG4 |
TAS5100A
SLES030 FEBRUARY 2002
12
www.ti.com
electrical characteristics, voltage regulator, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Output voltage (LDROUTA, LDROUTB)
IO = 5 mA,
PVDDA2 = PVDDB2 = 18 V to 27 V,
See Note 6,
DVDD = 3.3 V
14.5
15.3
16
V
NOTE 5: These voltage regulators are for internal gate drive circuits only and are not to be used under any circumstances to supply current to
external circuity.
THERMAL INFORMATION
The thermally enhanced DAP package is based on the 32-pin HTSSOP, but includes a thermal pad (see
Figure 4) to provide an effective thermal contact between the IC and the PWB.
Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO-220
type packages have leads formed as gull wings to make them applicable for surface-mount applications. These
packages, however, have two shortcomings: they do not address the low profile requirements (<2 mm) of many
of today’s advanced systems, and they do not offer a terminal-count high enough to accommodate increasing
integration. On the other hand, traditional low-power surface-mount packages require power-dissipation
derating that severely limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced HTSSOP) combines fine-pitch surface-mount technology with
thermal performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size
and limited mass of a HTSSOP package, thermal enhancement is achieved by improving the thermal
conduction paths that remove heat from the component. The thermal pad is formed using a patented lead-frame
design and manufacturing technique to provide a direct connection to the heat-generating IC. When this pad
is soldered or otherwise thermally coupled to an external heat dissipater, high power dissipation in the ultrathin,
fine-pitch, surface-mount package can be reliably achieved. See dissipation derating table.
DIE
Thermal
Pad
Side View (a)
End View (b)
Bottom View (c)
Figure 4. Views of Thermally Enhanced DAP Package
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TAS5100DAP | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Texas Instruments 功能描述: |
| TAS5101 | 制造商:TI 制造商全称:Texas Instruments 功能描述:TRUE DIGITAL STEREO AUDIO AMPLIFIER WITH PWM STEREO POWER OUTPUT STAGE |
| TAS5101DAP | 功能描述:音频放大器 Stereo Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5101DAPR | 功能描述:音频放大器 Stereo Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5101IDAP | 功能描述:音频放大器 Stereo Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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