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| 型号： | TAS5110ADADG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 50 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32 |
| 封装： | GREEN, PLASTIC, HTSSOP-32 |
| 文件页数： | 6/18页 |
| 文件大小： | 215K |
| 代理商： | TAS5110ADADG4 |
TAS5110A
SLES079A – APRIL 2003 – REVISED MAY 2003
www.ti.com
14
Thermal Methodology for the 32-Pin DAD Package 50 W, 6-
Test
The thermal test for the DAD part (e.g., thermal pad oriented away from the board) was conducted as shown in
Figure 7 and Figure 8. The cooling approach was to attach a heat sink to the thermal pad and conduct the heat to
ambient air.
Since the approach was to use a chassis below the board, it was inverted and a spacer bar used to connect the pads
thermally to the heat sink. The bar was made high enough that the components on the board were clear of the chassis.
The pad-to-spacer thermal resistance was about 3.2
°C/W with the thermal compound indicated.
The chassis provided the only heat sink to air and was chosen as representative of a possible cooling approach. A
closed plastic top and insulating front and back panels ensured that only the bottom and sides of the U shaped chassis
contributed to cooling. The chassis was spaced 0.25 inch from the table to simulate a normal chassis configuration.
The thermal pad does not need to be isolated from ground. (Any heat sink with a thermal resistance to air of 3.9
°C/W
or lower also works.) In this test, the exposed chassis reached long-term equilibrium temperatures above 50
°C, so
the approach would have to be modified for touch temperature consideration. The chassis temperature after 10
minutes of 50 W into 6
was below 50°C.
The test ran for three hours with 2
× 50 W RMS at 1 kHz into a 6- resistive load at an ambient lab temperature of
23
°C. No audio or thermal problems were encountered during that time.
32 DAD Package
Wakefield Type 126
Thermal Compound
(3.2
°C/W)
Stereo Amplifier Board
Wakefield Type 126
Thermal Compound
(0.169
°C/W)
1.25 in.
Insulating
Back Panel
Insulating
Front Panel
Plastic Top Cover
Aluminum Space Bar
(1/4 in. Thick)
(2.44
°C/W)
Aluminum Chassis 7.2 in.
× 1 in. × 0.1 in. Thick.
Sides of U-Shaped Chassis Are 1.25 in. High
(3.9
°C/W).
Figure 7. 32-Pin DAD Package Cross-Sectional View (Side)
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| TAS5110ADADR | 功能描述:音频放大器 50W Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5110ADADRG4 | 功能描述:音频放大器 50W Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5110DAD | 功能描述:音频放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5110DADG4 | 功能描述:音频放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5110DADR | 功能描述:音频放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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