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| 型号： | TAS5110ADADRG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 50 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32 |
| 封装： | GREEN, PLASTIC, HTSSOP-32 |
| 文件页数： | 5/18页 |
| 文件大小： | 215K |
| 代理商： | TAS5110ADADRG4 |
TAS5110A
SLES079A – APRIL 2003 – REVISED MAY 2003
www.ti.com
13
THERMAL INFORMATION
Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO-220 type
packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages,
however, have two shortcomings: they do not address the low profile requirements (<2 mm) of many of today’s
advanced systems, and they do not offer a terminal count that is high enough to accommodate increasing integration.
On the other hand, traditional low-power surface-mount packages require power-dissipation derating that severely
limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced HTSSOP) combines fine-pitch surface-mount technology with thermal
performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PCB. Because of the very small size and
limited mass of a HTSSOP package, thermal enhancement is achieved by improving the thermal conduction paths
that remove heat from the component. The thermal pad is formed using a patented lead-frame design and
manufacturing technique to provide a direct connection to the heat-generating IC. When this pad is soldered or
otherwise thermally coupled to an external heat dissipater, high power dissipation in the ultrathin, fine-pitch,
surface-mount package can be reliably achieved. See the dissipation derating table.
DIE
End View DAD
Thermal
Pad
Top View DAD
DAD Package
Figure 6. View of Thermally Enhanced DAD Package
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相关代理商/技术参数 |
参数描述 |
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| TAS5110DAD | 功能描述:音频放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5110DADG4 | 功能描述:音频放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5110DADR | 功能描述:音频放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5110DADRG4 | 功能描述:音频放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5110DAP | 功能描述:音频放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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