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参数资料
| 型号： | TAS5110ADAP |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 50 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32 |
| 封装： | POWERPAD, PLASTIC, HTSSOP-32 |
| 文件页数： | 8/20页 |
| 文件大小： | 290K |
| 代理商： | TAS5110ADAP |
TAS5110A
SLES079 – APRIL 2003
16
www.ti.com
Aluminum Chassis 7.2 in.
× 1 in. × 0.1 in. Thick. Sides of
U-Shaped Chassis Are 1.25 in. High (3.9
°C/W).
1.25 in.
Aluminum Space Bar (1/4 in. Thick)
(2.44
°C/W)
32 DAD Packages
(1.6
°C/W)
2.33 in.
Stereo Amplifier Board
4-40 Machine Screws With
Star Washers
Plastic Top and Insulating
Front and Back Panels
1 mm
Wakefield Type 126
Thermal Compound
(3.2
°C/W)
Wakefield Type 126
Thermal Compound
(0.169
°C/W)
Figure 8. 32-Pin DAD Package Cross-Sectional View (Front)
Thermal Methodology for the 32-Pin DAP Package 50 W, 6-
Test
The thermal test for the DAP part (e.g., thermal pad soldered to the board) was conducted as shown in Figure 9
and Figure 10. The cooling approach was to conduct the dissipated heat into the via pad on the board, through
the vias in the board, and into a heat sink.
The lower via pad area, slightly larger than the IC pad itself, was exposed with a window in the solder resist on
the bottom surface of the board. It was not coated with solder during the board construction to maintain a flat
surface. In production, this could be accomplished with a peelable solder mask.
A spacer bar was used to keep the through-hole leads from shorting to the chassis. The thermal compound
indicated yielded a pad-to-spacer thermal resistance of about 3.2
_C/W.
The chassis provided the only heat sink to air and was chosen as representative of a possible cooling approach.
A plastic top and insulating front and back panels were used to ensure that only the bottom and sides of the U
shaped chassis contributed to cooling. The chassis was spaced 0.25 inch from the table to simulate a normal
chassis configuration. (Any heat sink with a thermal resistance to air of 3.9
_C/W or lower also works.) In this
test, the exposed chassis reached long-term equilibrium temperatures above 50
_C, so the approach would
have to be modified for touch temperature consideration. The chassis temperature after 10 minutes of 50 W
into 6
was below 50_C.
The test ran for three hours with 2
× 50 W RMS at 1 kHz into a 6- resistive load at an ambient lab temperature
of 23
_C. No audio quality or thermal problems were encountered during that time.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TAS5110DAD | 功能描述:音频放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5110DADG4 | 功能描述:音频放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5110DADR | 功能描述:音频放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5110DADRG4 | 功能描述:音频放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5110DAP | 功能描述:音频放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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