TAS5111
SLES049D JULY 2003 REVISED MARCH 2004
www.ti.com
2
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
GENERAL INFORMATION
Terminal Assignment
The TAS5111 is offered in a thermally enhanced 32-pin
TSSOP surface-mount package (DAD), which has the
thermal pad on top.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
PWM_BP
GND
RESET
DREG_RTN
GREG
M3
DREG
DGND
M1
M2
DVDD
SD
DGND
OTW
GND
PWM_AP
GVDD
GND
BST_B
PVDD_B
OUT_B
GND
OUT_A
PVDD_A
BST_A
GND
GVDD
DAD PACKAGE
(TOP VIEW)
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
TAS5111
UNITS
DVDD TO DGND
–0.3 V to 4.2 V
GVDD TO GND
33.5 V
PVDD_X TO GND (dc voltage)
33.5 V
PVDD_X TO GND (spike voltage(2))
48 V
OUT_X TO GND (dc voltage)
33.5 V
OUT_X TO GND (spike voltage(2))
48 V
BST_X TO GND (dc voltage)
48 V
BST_X TO GND (spike voltage(2))
53 V
GREG TO GND (3)
14.2 V
PWM_XP, RESET, M1, M2, M3, SD,
OTW
–0.3 V to DVDD + 0.3 V
Maximum operating junction
temperature, TJ
–40
°C to 150°C
Storage temperature
–40
°C to 125°C
(1) Stresses beyond those listed under “absolute maximum ratings”
may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any
other conditions beyond those indicated under “recommended
operating conditions” is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device
reliability.
(2) The duration of a voltage spike should be less than 100 ns.
(3) GREG is treated as an input when the GREG pin is overdriven by
a GVDD voltage of 12 V.
PACKAGE DISSIPATION RATINGS
PACKAGE
RθJC
(
°C/W)
RθJA
(
°C/W)
32-Pin DAD TSSOP
1.69
See Note 1
(1) The TAS5111 package is thermally enhanced for conductive
cooling using an exposed metal pad area. It is impractical to use the
device with the pad exposed to ambient air as the only means for
heat dissipation.
For this reason, RθJA, a system parameter that characterizes the
thermal treatment, is provided in the Application Information section
of the data sheet. An example and discussion of typical system
RθJA values are provided in the Thermal Information section. This
example provides additional information regarding the power
dissipation ratings. This example should be used as a reference to
calculate the heat dissipation ratings for a specific application. TI
application engineering provides technical support to design
heatsinks if needed. Also, for additional general information on
PowerPad packages, see TI document SLMA002.
ORDERING INFORMATION
TA
PACKAGE
DESCRIPTION
0
°C to 70°C
TAS5111DAD
32-pin small TSSOP
For
the
most
current
specification
and
package
information, refer to the TI Web site at www.ti.com.