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参数资料
| 型号： | TAS5121DKDR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 100 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
| 封装： | GREEN, PLASTIC, HSSOP-36 |
| 文件页数： | 6/21页 |
| 文件大小： | 591K |
| 代理商： | TAS5121DKDR |
TAS5121
SLES086A NOVEMBER 2003 REVISED MARCH 2004
www.ti.com
14
RθJA is a system thermal resistance from junction to
ambient air. As such, it is a system parameter with roughly
the following components:
D RθJC (the thermal resistance from junction to
case, or in this case the metal pad)
D Heatsink compound thermal resistance
D Heatsink thermal resistance
The thermal grease thermal resistance can be calculated
from the exposed pad area and the thermal grease
manufacturer’s area thermal resistance (expressed in
°C-in2/W). The area thermal resistance of the example
thermal grease with a 0.001-inch thick layer is about 0.054
°C-in2/W. The approximate exposed pad area is as
follows:
36-pin PSOP3
0.116 in2
Dividing the example thermal grease area resistance by
the area of the pad gives the actual resistance through the
thermal grease for the device:
36-pin PSOP3
0.47
°C/W
The thermal resistance of thermally conductive pads is
generally higher than a thin thermal grease layer. Thermal
tape has an even higher thermal resistance and should not
be used with this package.
Heatsink thermal resistance is generally predicted by the
heatsink vendor, modeled using a continuous flow
dynamics (CFD) model, or measured.
Thus, for a single monaural IC, the system RθJA = RθJC +
thermal grease resistance + heatsink resistance.
The following table indicates modeled parameters for one
TAS5121 IC on a heatsink. The junction temperature is set
at 110
°C while delivering 70 W RMS into 4- loads with no
clipping. It is assumed that the thermal grease is about
0.001 inch thick (this is critical).
Table 4. Example of Thermal Simulation
36-Pin PSOP3
Ambient temperature
25
°C
Power to load
70 W
Delta T inside package
5.5
°C
Delta T through thermal grease
3.2
°C
Required heatsink thermal resistance
11.0
°C/W
Junction temperature
110
°C
System RθJA
12.3
°C/W
RθJA * power dissipation
85
°C
RθJC
0.85
°C/W
As an indication of the importance of keeping the thermal
grease layer thin, if the thermal grease layer increases to
0.002 inches thick, the required heatsink thermal
resistance increases to 5.2
°C/W for the PSOP3 package.
REFERENCES
1.
Digital Audio Measurements application report—TI
(SLAA114)
2.
PowerPAD
Thermally
Enhanced
Package
technical brief—TI (SLMA002)
3.
System Design Considerations for True Digital
Audio Power Amplifiers application report—TI
(SLAA117)
4.
Voltage
Spike
Measurement
Technique
and
Specification application note—TI (SLEA025)
相关PDF资料 |
PDF描述 |
|---|---|
| TAS5121DKD | 100 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
| TAS5121IDKDE4 | 100 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
| TAS5121IDKDRE4 | 100 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
| TAS5121IDKDR | 100 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
| TAS5121IDKD | 100 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TAS5121DKDRE4 | 功能描述:音频放大器 TAS5121 Digital Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5121I | 制造商:TI 制造商全称:Texas Instruments 功能描述:DIGITAL AMPLIIFIER POWER STAGE |
| TAS5121IDKD | 功能描述:音频放大器 Digital Amplifier Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5121IDKDE4 | 功能描述:音频放大器 Digital Amplifier Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5121IDKDR | 功能描述:音频放大器 Digital Amplifier Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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