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参数资料
| 型号： | TAS5121IDKDR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 100 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
| 封装： | GREEN, PLASTIC, HSSOP-36 |
| 文件页数： | 7/22页 |
| 文件大小： | 632K |
| 代理商： | TAS5121IDKDR |
www.ti.com
REFERENCES
TAS5121I
SLES122 – SEPTEMBER 2004
APPLICATION INFORMATION (continued)
36-pin PSOP3
0.47
°C/W
The thermal resistance of thermally conductive pads is generally higher than a thin thermal grease layer.
Thermal tape has an even higher thermal resistance and should not be used with this package.
Heatsink thermal resistance is generally predicted by the heatsink vendor, modeled using a continuous flow
dynamics (CFD) model, or measured.
Thus, for a single monaural IC, the system RθJA = RθJC + thermal grease resistance + heatsink resistance.
Table 7 indicates modeled parameters for one TAS5121I IC on a heatsink. The junction temperature is set at
110
°C while delivering 70 W RMS into 4- loads with no clipping. It is assumed that the thermal grease is about
0.001 inch thick (this is critical).
Table 7. Example of Thermal Simulation
36-PIN PSOP3
Ambient temperature
25
°C
Power to load
70 W
Delta T inside package
5.5
°C
Delta T through thermal grease
3.2
°C
Required heatsink thermal resistance
11.0
°C/W
Junction temperature
110
°C
System RθJA
12.3
°C/W
RθJA * power dissipation
85
°C
RθJC
0.85
°C/W
As an indication of the importance of keeping the thermal grease layer thin, if the thermal grease layer increases
to 0.002 inches thick, the required heatsink thermal resistance increases to 5.2
°C/W for the PSOP3 package.
1. Digital Audio Measurements application report – TI (SLAA114)
2. PowerPAD Thermally Enhanced Package technical brief – TI (SLMA002)
3. System Design Considerations for True Digital Audio Power Amplifiers application report – TI (SLAA117)
4. Voltage Spike Measurement Technique and Specification application note – TI (SLEA025)
15
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| TAS5121IDKDRE4 | 功能描述:音频放大器 Digital Amplifier Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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| TAS5122_07 | 制造商:TI 制造商全称:Texas Instruments 功能描述:30-W STEREO DIGITAL AMPLIFIER POWER STAGE |
| TAS5122DCA | 功能描述:音频放大器 TAS5122: Digital Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5122DCAG4 | 功能描述:音频放大器 TAS5122: Digital Amp Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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