![](http://datasheet.mmic.net.cn/130000/TAS5424ATPHDMQ1_datasheet_5016264/TAS5424ATPHDMQ1_39.png)
www.ti.com
SLOS535B – MAY 2009 – REVISED JANUARY 2010
Thermal grease thermal resistance
Heat sink thermal resistance
The thermal grease thermal resistance can be calculated from the exposed heat slug area and the thermal
grease manufacturer's area thermal resistance (expressed in °C-in2/W or °C-mm2/W). The area thermal
resistance of the example thermal grease with a 0.001-inch (0.0254-mm) thick layer is about 0.007°C-in2/W
(4.52°C-mm2/W). The approximate exposed heat slug size is as follows:
TAS5424A, 44-pin PSOP3 …………………. 0.124 in2 (80 mm2)
TAS5414A, 36-pin PSOP3 …………………. 0.124 in2 (80 mm2)
TAS5414A, TAS5424A, 64-pin QFP……….. 0.099 in2 (64 mm2)
Dividing the example thermal grease area resistance by the area of the heat slug gives the actual resistance
through the thermal grease for both parts:
TAS5424A, 44-pin PSOP3 …………………. 0.06°C/W
TAS5414A, 36-pin PSOP3 …………………. 0.06°C/W
TAS5414A, TAS5424A, 64-pin QFP……….. 0.07°C/W
The thermal resistance of thermal pads is generally considerably higher than a thin thermal grease layer.
Thermal tape has an even higher thermal resistance and should not be used at all. Heat sink thermal resistance
generally is predicted by the heat sink vendor, modeled using a continuous flow dynamics (CFD) model, or
measured.
Thus, for a single monaural channel in the IC, the system RqJA = RqJC + thermal grease resistance + heat sink
resistance.
The following table indicates modeled parameters for one TAS5414A or TAS5424A IC on a heat sink. The
junction temperature is set at 115°C in both cases while delivering 20 Wrms per channel into 4-
loads with no
clipping. It is assumed that the thermal grease is about 0.001 inches (0.0254 mm) thick.
Device
TAS5414A, 36-Pin PSOP3
Ambient temperature
25°C
Power to load
20 W × 4
Power dissipation
1.90 W × 4
ΔT inside package
7.6°C
ΔT through thermal grease
0.46°C
Required heatsink thermal resistance
10.78°C/W
Junction temperature
115°C
System RqJA
11.85°C/W
RqJA × power dissipation
90°C
Electrical Connection of Heat Slug and Heat Sink
Any heat sink that is connected to the heat slug of the TAS5414A or TAS5424A should be connected to GND or
left floating. The heat slug should never be connected to any electrical node other than GND.
Copyright 2009–2010, Texas Instruments Incorporated
39