参数资料
型号: TB6607FLG
元件分类: 运动控制电子
英文描述: STEPPER MOTOR CONTROLLER, 0.8 A, PQCC36
封装: 6 X 6 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, QON-36
文件页数: 5/18页
文件大小: 262K
代理商: TB6607FLG
TB6607FLG
2008-01-15
13
QON Package Considerations
Package Appearances
Please follow the following guidelines for the QON package.
Guidelines:
(1)
The solder plated pads at the four corners of the package (shaded areas in the bottom view) should not
be soldered for the purpose of improving the mechanical strength of solder joints.
(2)
When using the TB6607FLG, it should be ensured that the thermal pad and solder plated pads
(shaded areas in the top and bottom views) are electrically insulated (Note).
Note: Care should be taken in the board design to prevent solder for through-hole joints from flowing to the
solder plated pads on the bottom of the package (shaded areas in the bottom view).
When mounting or soldering this package, care must be taken to avoid electrostatic discharge or
electrical overstress to the IC. (This is to avoid electrical leakage and a buildup of electrostatic
charge in the end product.)
It should be ensured that no voltage is directly applied to the solder plated pads when designing
the PC board.
(Top view)
(Bottom view)
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