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参数资料
| 型号： | TB7004FL |
| 元件分类： | 稳压器 |
| 英文描述： | SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PQCC56 |
| 封装： | 8 X 8 MM, PLASTIC, QFN-56 |
| 文件页数： | 5/16页 |
| 文件大小： | 264K |
| 代理商： | TB7004FL |
TB7004FL
2008-05-23
13
Thermal Shutdown
If the integrated driver IC temperature exceeds 165°C, thermal shutdown is tripped.
TSD hysteresis: 15°C (typ.)
If the integrated MOS chip is the heating source, it takes some time for the overtemperature to be detected
at the sensor due to the distance between them. The chip temperature might exceed the TSD threshold
before the thermal shutdown circuitry is tripped.
In the TSD mode, the TB7004FL turns off both the low-side and high-side MOSFETs and keeps the internal
5-V regulator active.
THDN
THDN is an open-drain output that indicates thermal shutdown.
An external pull-up resistor should be connected to this pin.
During normal operation, the internal switch is off, causing THDN to be High.
In thermal shutdown mode, the internal switch is on, causing THDN to be Low.
BOOT
BOOT is an input pin from which the bootstrap capacitor is charged.
The bootstrap capacitor should be connected between this pin and VSWH.
While the PWM signal is Low (i.e., the high-side MOSFET is off), the bootstrap capacitor is charged from the
internal 5-V regulator. Be sure to use a sufficiently large capacitor.
Typical capacitance:
> 0.2 μF (VIN = 12 V, VOUT = 1.3 V, fC = 1 MHz)
Thermal
shutdown
Normal
operation
150
165
TIC (°C)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TB7004FL(ELSK,Q) | 制造商:Toshiba America Electronic Components 功能描述:IC REG BUCK SYNC 30A 56QFN |
| TB7005FL(EL1SK,Q) | 制造商:Toshiba America Electronic Components 功能描述:MULTI-CHIP MODULE, 30V, 35A, QFN-56L - Tape and Reel |
| TB7005FL(ELSK,Q) | 制造商:Toshiba America Electronic Components 功能描述:MULTI-CHIP MODULE, 30V, 35A, QFN-56L - Tape and Reel 制造商:Toshiba America Electronic Components 功能描述:IC REG BUCK SYNC 30A 56QFN |
| TB701-0X | 制造商:PLL 制造商全称:PLL 功能描述:TB701-0X |
| TB70150 | 制造商:Thomas & Betts 功能描述:VICE FERRULE TOOL 2/0-300MCM |
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