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参数资料
| 型号： | TBME337K010LBSB0823 |
| 厂商： | AVX Corporation |
| 文件页数： | 1/3页 |
| 文件大小： | 0K |
| 描述： | MULTIANODE CAP 330UF 10V SMD |
| 标准包装： | 100 |
| 系列： | TBM |
| 电容： | 330µF |
| 电压 - 额定： | 10V |
| 容差： | ±10% |
| ESR（等效串联电阻）： | 23 毫欧 |
| 类型： | 模制 |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 2917（7343 公制） |
| 尺寸/尺寸： | 0.287" L x 0.169" W（7.30mm x 4.30mm） |
| 高度 - 座高（最大）： | 0.170"（4.30mm） |
| 制造商尺寸代码： | E |
| 特点： | COTS（高可靠性） |
| 包装： | 散装 |
| 其它名称： | 478-7284 |
TBM Multianode
Tantalum Ultra Low ESR Space Level
TBM Space Level series is screened to
SRC9000 and utilizes an internal multi-
anode design to achieve ultra-low ESR
which improves performance in high
ripple power application.
TBM Space Level is available with Weibull
Grade "C" reliability and MIL-PRF-55365
Rev. G surge test option "C".
There are four termination finishes
available: solder plated, fused solder
plated, hot solder dipped and gold
plated (these correspond to “H”, “K”, “C”
and “B” termination, respectively, per
MIL-PRF-55365).
The molding compound has been
selected to meet the requirements
of UL94V-0 (Flame Retardancy) and
outgassing requirements of NASA
SP-R-0022A.
This product is considered MSL 3 in
accordance with J-STD-020.
L
W
CASE DIMENSIONS: millimeters (inches)
H
Code
D
E
L±0.20
(0.008)
7.30 (0.287)
7.30 (0.287)
W+0.20 (0.008)
–0.10 (0.004)
4.30 (0.169)
4.30 (0.169)
H+0.20 (0.008)
–0.10 (0.004)
2.90 (0.114)
4.10 (0.162)
W 1 ±0.20
(0.008)
2.40 (0.094)
2.40 (0.094)
A+0.30 (0.012)
–0.20 (0.008)
1.30 (0.051)
1.30 (0.051)
S Min.
4.40 (0.173)
4.40 (0.173)
A
S
A
W 1
W 1 dimension applies to the termination width for A dimensional area only.
CAPACITANCE AND RATED VOLTAGE RANGE
LETTER DENOTES CASE SIZE ESR LIMIT IN BRACKETS
Capacitance
Rated Voltage DC (V R ) to 85°C
μF Code
2.5V (e)
4V (G)
6V (J)
10V (A) 12V (B) 16V (C)
20V (D)
25V (E)
35V (V)
10
15
106
156
22
226
D(70)
E(60,100)
33
47
68
100
150
336
476
686
107
157
E(30,40)
E(35,45)
D(65)
E(65)
E(50,65)
220
227
D(35)
E*
330
470
337
477
D(35)
D(35)
D(35)
E(30)
E(35)
E*
680
687
E(23)
1000
1500
108
158
D(25)
E(18)
E(23)
Available Ratings: ESR limits quoted in brackets (mOhms)
Engineering samples - please contact manufacturer
*Codes under development - subject to change.
TBM D MULTIANODE CONSTRUCTION
Notes: Voltage ratings are minimum values. AVX reserves the right to supply
higher ratings in the same case size, to the same reliability standards.
EIA standards for Low ESR solid tantalum capacitors allow an ESR
movement of 1.25 times initial limit post mounting.
TBM E MULTIANODE CONSTRUCTION
SEPTEMBER 2013
n 47
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TBME337K010LBSB0923 | 功能描述:钽质电容器-固体SMD 10volts 330uF 10% CASE E ULTRA LOW ESR RoHS:否 制造商:AVX 电容:100 uF 电压额定值:20 V ESR: 容差:10 % 外壳代码 - in:2917 外壳代码 - mm:7343 高度:4.1 mm 制造商库存号:E Case 工作温度范围:- 55 C to + 125 C 系列:TBM 产品:Tantalum Solid Low ESR Commercial Grade 封装:Bulk |
| TBME337K010LBSZ0000 | 功能描述:钽质电容器-固体SMD 10volts 330uF 10% CASE E ULTRA LOW ESR RoHS:否 制造商:AVX 电容:100 uF 电压额定值:20 V ESR: 容差:10 % 外壳代码 - in:2917 外壳代码 - mm:7343 高度:4.1 mm 制造商库存号:E Case 工作温度范围:- 55 C to + 125 C 系列:TBM 产品:Tantalum Solid Low ESR Commercial Grade 封装:Bulk |
| TBME337K010LRLB0H00 | 制造商:AVX Corporation 功能描述:BIDD TANTALUM CHIP / BIDD SPECIAL |
| TBME337K010LRSB0800 | 制造商:AVX Corporation 功能描述:CAP 330UF 10VDC 10% 7.3 X 4.3 X 4.1MM SMD 7343-43 - Bulk |
| TBME337K010LRSB0823 | 制造商:AVX Corporation 功能描述:TANTALUM CAP - Custom Tape W/Leader |
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