参数资料
| 型号： | TBU-CA025-050-WH |
| 厂商： | Bourns Inc. |
| 文件页数： | 4/6页 |
| 文件大小： | 0K |
| 描述： | SURGE SUPP TBU 50MA 250VIMP SMD |
| 产品目录绘图： | TBU-CA Series Top TBU-CA Series Side |
| 标准包装： | 1 |
| 系列： | TBU-CA |
| 电压 - 工作： | 100V |
| 电压 - 箝位： | 250V |
| 技术： | 混合技术 |
| 电路数： | 2 |
| 应用： | 通用 |
| 封装/外壳： | SMD 6.50mm x 4.00mm |
| 供应商设备封装： | SMD |
| 包装： | 标准包装 |
| 其它名称： | TBU-CA025-050-WHDKR |
TBU-CA Series - TBU ? High-Speed Protectors
Product Dimensions
0.70
(.028)
0.80
6.50 ± 0.10
(.256 ± .004)
0.85 ± 0.05
(.033 ± .002)
1.85
(.073)
0.30
(.012)
(.031)
0.70
(.028)
1.85
(.073)
4.00 ± 0.10
(.157 ± .004)
3.40
(.134)
PIN 1 & BACKSIDE CHAMFER
0.30
(.012)
C
0.25
(.010)
PIN 1
0.00 - 0.05
Pad Designation
(.000 - .002)
Pad #
Pin Out
DIMENSIONS:
MM
(INCHES)
1
2
3
Line In/Out
NU
Line Out/In
Recommended Pad Layout
TBU ? High-Speed Protectors have a 100 % matte-tin termination
?nish. For improved thermal dissipation, the recommended layout
uses PCB copper areas which extend beyond the exposed solder
pad. The exposed solder pads should be de?ned by a solder mask
which matches the pad layout of the TBU ? device in size and spac-
ing. It is recommended that they should be the same dimension as
the TBU ? pads but if smaller solder pads are used, they should be
centered on the TBU ? package terminal pads and not more than
0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length.
3
2
1
Solder pad areas should not be larger than the TBU ? pad sizes
to ensure adequate clearance is maintained. The recommended
stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil
opening size 0.025 mm (0.0010 in.) less than the solder pad size.
Extended copper areas beyond the solder pad signi?cantly improve
the junction to ambient thermal resistance, resulting in operation
at lower junction temperatures with a corresponding bene?t of reli-
ability. All pads should soldered to the PCB, including pads marked
as NC or NU but no electrical connection should be made to these
Dark grey areas show added PCB copper area for better
thermal resistance.
pads. For minimum parasitic capacitance, it is recommended that
signal, ground or power signals are not routed beneath any pad.
Speci?cations are subject to change without notice.
Customers should verify actual device performance in their speci?c applications.
相关PDF资料 |
PDF描述 |
|---|---|
| 5MFP 80-R | FUSE 80MA 250VAC AXIAL FAST |
| 5MFP 300-R | FUSE 300MA 250VAC AXIAL FAST |
| MAX4372FESA | IC AMP GAIN +50V/V PREC 8-SOIC |
| 5MFP 200-R | FUSE 200MA 250VAC AXIAL FAST |
| 5MFP 700-R | FUSE 700MA 250VAC AXIAL FAST |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TBU-CA025-050-WH_11 | 制造商:BOURNS 制造商全称:Bourns Electronic Solutions 功能描述:TBU-CA Series - TBU?? High-Speed Protectors |
| TBU-CA025-100-WH | 功能描述:浪涌抑制器 Bi-directional TBU RoHS:否 制造商:Bourns 电压额定值:40 V 电流额定值:750 mA 工作温度范围:- 40 C to + 125 C 端接类型:SMD/SMT 封装 / 箱体: |
| TBU-CA025-200-WH | 功能描述:浪涌抑制器 Bi-directional TBU RoHS:否 制造商:Bourns 电压额定值:40 V 电流额定值:750 mA 工作温度范围:- 40 C to + 125 C 端接类型:SMD/SMT 封装 / 箱体: |
| TBU-CA025-300-WH | 功能描述:浪涌抑制器 Bi-directional TBU RoHS:否 制造商:Bourns 电压额定值:40 V 电流额定值:750 mA 工作温度范围:- 40 C to + 125 C 端接类型:SMD/SMT 封装 / 箱体: |
| TBU-CA025-500-WH | 功能描述:浪涌抑制器 Bi-directional TBU RoHS:否 制造商:Bourns 电压额定值:40 V 电流额定值:750 mA 工作温度范围:- 40 C to + 125 C 端接类型:SMD/SMT 封装 / 箱体: |
发布紧急采购，3分钟左右您将得到回复。