参数资料
型号: TC1428CPA
厂商: Microchip Technology Inc.
英文描述: 1.2A Dual High-Speed MOSFET Drivers
中文描述: 1.2A的双路高速MOSFET驱动器
文件页数: 2/6页
文件大小: 81K
代理商: TC1428CPA
4-208
TELCOM SEMICONDUCTOR, INC.
1.2A DUAL HIGH-SPEED MOSFET DRIVERS
TC1426
TC1427
TC1428
ELECTRICAL CHARACTERISTICS:
T
A
= 25
°
C with 4.5V
V
DD+
16V unless otherwise specified.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
Input
V
IH
V
IL
I
IN
Output
V
OH
V
OL
R
O
Logic 1, Input Voltage
3
V
Logic 0, Input Voltage
0.8
V
Input Current
0V
V
IN
V
DD
– 1
1
μ
A
High Output Voltage
Test Figures 1 and 2
V
DD
– 0.025
V
Low Output Voltage
Test Figures 1 and 2
0.025
V
Output Resistance
V
IN
= 0.8V,
I
OUT
= 10 mA, V
DD
= 16V
V
IN
= 3V,
I
OUT
= 10 mA, V
DD
= 16V
12
18
8
12
I
PK
I
Peak Output Current
1.2
A
Latch-Up Current
Withstand Reverse Current
> 500
mA
Switching Time
(Note 1)
t
R
t
F
t
D1
t
D2
Power Supply
Rise Time
Test Figures 1 and 2
35
nsec
Fall Time
Test Figures 1 and 2
25
nsec
Delay Time
Test Figures 1 and 2
75
nsec
Delay Time
Test Figures 1 and 2
75
nsec
I
S
Power Supply Current
V
IN
= 3V (Both Inputs)
V
IN
= 0V (Both Inputs)
9
mA
0.5
Note:
1. Switching times guaranteed by design.
ABSOLUTE MAXIMUM RATINGS*
Power Dissipation (T
A
70
°
C)
Plastic DIP ...........................................................730W
SOIC ................................................................470 mW
Derating Factor
Plastic DIP ..................................................... 8 mW/
°
C
SOIC .............................................................. 4 mW/
°
C
Supply Voltage ............................................................18V
Input Voltage, Any Terminal..
(V
DD
+ 0.3V) to (GND – 0.3V)
Operating Temperature: C Version..............0
°
C to +70
°
C
E Version.........– 40
°
C to +85
°
C
*Stresses above those listed under "Absolute Maximum Ratings" may
cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions above
those indicated in the operational sections of the specifications is not
implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
Maximum Chip Temperature.................................+150
°
C
Storage Temperature .............................+65
°
C to +150
°
C
Lead Temperature (Soldering ,10 sec) .................+300
°
C
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