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参数资料
| 型号： | TC2H666K025LBDC0845 |
| 厂商： | AVX Corporation |
| 文件页数： | 1/3页 |
| 文件大小： | 0K |
| 描述： | MODULE CAP TANT 66UF 10% 25V |
| 标准包装： | 200 |
| 系列： | TCP |
| 电容： | 66µF |
| 电压 - 额定： | 25V |
| 容差： | ±10% |
| ESR（等效串联电阻）： | 85 毫欧 |
| 类型： | 模制 |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 0.308" L x 0.160" W x 0.240" H（7.82mm x 4.06mm x 6.10mm） |
| 尺寸/尺寸： | 0.308" L x 0.160" W（7.82mm x 4.06mm） |
| 高度 - 座高（最大）： | 0.240"（6.10mm） |
| 制造商尺寸代码： | 2H |
| 包装： | 散装 |
| 其它名称： | 478-7291 |
TCP Series
TCP Series Low ESR Tantalum Modules
TCP Series tantalum modules rep-
resents the highest packing density
for high capacitance / voltage avail-
able in surface mount tantalum.
These modules feature stacked
assemblies of CWR29 capacitors
which provide ultra low ESR and uti-
lize established reliability capacitors
(Weibull Grade voltage conditioning)
in accordance with MIL-PRF-55365.
They can also be supplied with
SRC9000 Space Level components.
The stacked construction of fully
molded capacitors is compatible with
a wide range of SMT board assembly
processes including wave or reflow
solder or conductive epoxy.
There are two termination finishes
available: hot solder dipped (“C”) and
gold plated (“B”).
The molding compound has been
selected to meet the requirements of
UL94V-0 and outgassing require-
ments of NASA SP-R-0022A.
This product is considered to be MSL
3 in accordance with J-STD-020.
W
L
Note: Additional form factors and ratings are available.
H
CAPACITANCE AND RATED VOLTAGE
CASE SIZE (ESR IN m )
Capacitance
Contact plant for details.
Rated voltage DC (V R ) to 85oC
μF Code
6V
10V
15V 20V 25V
35V
50V
9.4 945
18.8 196
20 206
28.2 286
40 406
60 606
66 666
94 946
132 137
188 197
198 207
200 207
282 287
400 407
440 447
600 607
660 667
880 887
2H (50)
2H (50)
4H (25)
2H (63)
4H (31)
6H (21)
2H (75)
4H (38)
6H (25)
2H (85)
4H (43)
6H (28)
2H (200)
4H (100)
6H (67)
2H (200)
4H (100)
6H (67)
1,320 138
1,980 208
4H (25)
6H (17)
6H (17)
SEPTEMBER 2013
n 27
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