参数资料
型号: TC500IOE713
元件分类: 模拟信号调理
英文描述: SPECIALTY ANALOG CIRCUIT, PDSO16
封装: 0.300 INCH, PLASTIC, MS-013, SOIC-16
文件页数: 15/34页
文件大小: 634K
代理商: TC500IOE713
TC500/A/510/514
DS21428D-page 22
2006 Microchip Technology Inc.
16-Lead Plastic Dual In-line (PE) – 300 mil (PDIP)
2
1
D
n
E1
c
β
eB
E
α
p
L
A2
B
B1
A
A1
15
10
5
15
10
5
β
Mold Draft Angle Bottom
15
10
5
15
10
5
α
Mold Draft Angle Top
10.92
9.40
7.87
.430
.370
.310
eB
Overall Row Spacing
0.56
0.46
.036
.022
.018
.014
B
Lower Lead Width
1.78
1.46
1.14
.070
.058
.045
B1
Upper Lead Width
0.38
0.29
0.20
.015
.012
.008
c
Lead Thickness
3.43
3.30
3.18
.135
.130
.125
L
Tip to Seating Plane
19.30
19.05
18.80
.760
.750
.740
D
Overall Length
6.60
6.35
6.10
.260
.250
.240
E1
Molded Package Width
8.26
7.94
7.62
.325
.313
.300
E
Shoulder to Shoulder Width
0.38
.015
A1
Base to Seating Plane
3.68
3.30
2.92
.145
.130
.115
A2
Molded Package Thickness
4.32
3.94
3.56
.170
.155
.140
A
Top to Seating Plane
2.54
.100
p
Pitch
16
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
Notes:
JEDEC Equivalent: MS-001
Revised 07-21-05
* Controlling Parameter
Drawing No. C04-017
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