参数资料
型号: TC534CKW
厂商: Microchip Technology
文件页数: 10/28页
文件大小: 0K
描述: IC DATA ACQ SUBSYSTEM 44-MQFP
标准包装: 96
类型: 数据采集系统(DAS)
分辨率(位): 17 b
采样率(每秒): 6.5
数据接口: 串行
电压电源: 单电源
电源电压: 4.5 V ~ 5.5 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 44-QFP
供应商设备封装: 44-MQFP(10x10)
包装: 托盘
TC530/TC534
DS21433C-page 18
2007 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (PJ) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
28
Pitch
e
.100 BSC
Top to Seating Plane
A
.200
Molded Package Thickness
A2
.120
.135
.150
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.290
.310
.335
Molded Package Width
E1
.240
.285
.295
Overall Length
D
1.345
1.365
1.400
Tip to Seating Plane
L
.110
.130
.150
Lead Thickness
c
.008
.010
.015
Upper Lead Width
b1
.040
.050
.070
Lower Lead Width
b
.014
.018
.022
Overall Row Spacing §
eB
.430
NOTE 1
N
12
D
E1
eB
c
E
L
A2
e
b
b1
A1
A
3
Microchip Technology Drawing C04-070B
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