
3
TC6501
TC6502
TC6501/02-1 1/17/00
Ultra Small Temperature Switch
with Pin-Selectable Hysteresis
PIN DESCRIPTION
TC6501 TC6502
Name
Description
1,2
GND
Ground. Ground both pins together close to the chip. Pin 2 provides the
lowest thermal resistance to the die.
3
HYST
Hysteresis Input. Connect HYST to GND for +2
°C hysteresis, or connect
to VCC for +10°C hysteresis.
44
VCC
Supply Input (+2.7V to +5.5V). Recommend 100pF or greater from VCC to GND.
5
—
TOVER
Open-Drain, Active-Low Output. TOVER goes low when the die tempera-
ture exceeds the factory-programmed temperature threshold. Connect to a
100 K
pull-up resistor. May be pulled up to a voltage higher than VCC.
—
5
TOVER
Push/Pull Active-High Output. TOVER goes high when the die tempera-
ture exceeds the factory-programmed temperature threshold.
DETAILED DESCRIPTION
The TC6501 and TC6502
integrate a temperature
sensor with a factory programmed threshold switch. A logic
signal is asserted when the die temperature crosses the
factory programmed threshold. An external hysteresis input
pin allows the user to select either 2
°C or 10°C hysteresis to
give further flexibility to the design of the application. The
TC6501 and TC6502 are intended for a temperature range
from 35
°C to 115°C in a 10°C increment. The TC6501 has
an open drain output and the TC6502 has a push /pull output
stage.
The TC6501 is intended for applications with a micro-
processor reset input. The TC6502 is intended for applica-
tions of turning on a fan or heater element.
TYPICAL OPERATING CIRCUIT
Hysteresis Input
To prevent the output from “chattering” at or near the trip
point temperature, a selectable HYST input pin is provided.
Hysteresis can be externally selected at 2
°C (HYST = GND)
or 10
°C (HYST = VDD) by means of the CMOS compatible
HYST input pin.Do not let the HYST pin float as this could
cause increase supply current. The hysteresis does not
depend on the part’s programmed trip threshold.
Table 1. Factory-Programmed Threshold Range
Part
Number
Threshold (TTH) Range
TC6501
+35
°C < TTH < +115°C
TC6502
+35
°C < TTH < +115°C
Thermal Considerations
With a very low 17
A supply current, the TC6501 and
TC6502 dissipates very little power. Thus, the die tempera-
ture is basically the same as the package temperature. To
minimize the error in temperature readings, the load current
should be limited to a few milliamps. As an example, the
typical thermal resistance of an 5-Pin SOT-23A package is
140C/W. If for instance the TC6501 had to sink 1mA, and the
output voltage is guaranteed to be less than 0.3V, then an
additional 0.3mW of power is dissipated within the IC. This
corresponds to a 0.042 C rise in die temperature in the 5-Pin
SOT23.
Good temperature monitoring depends on the thermal
resistance between the device being monitored and the
TC6501 and TC6502 die. Heat flows primarily through the
GND GND HYST
+2.7V to +5.5V
VCC
INT
P
TOVER
VCC
TC6502
GND
100pF