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参数资料
| 型号： | TC7135CPI |
| 元件分类： | ADC |
| 英文描述： | 1-CH DUAL-SLOPE ADC, PDIP28 |
| 封装： | 0.600 INCH, PLASTIC, MO-011, DIP-28 |
| 文件页数： | 9/24页 |
| 文件大小： | 471K |
| 代理商： | TC7135CPI |
2004 Microchip Technology Inc.
DS21460C-page 17
TC7135
28-Lead Plastic Leaded Chip Carrier (LI) – Square (PLCC)
10
5
0
10
5
0
β
Mold Draft Angle Bottom
10
5
0
10
5
0
α
Mold Draft Angle Top
0.53
0.51
0.33
.021
.020
.013
B
Lower Lead Width
0.81
0.74
0.66
.032
.029
.026
B1
Upper Lead Width
0.33
0.27
0.20
.013
.011
.008
c
Lead Thickness
7
n1
Pins per Side
10.92
10.67
10.41
.430
.420
.410
D2
Footprint Length
10.92
10.67
10.41
.430
.420
.410
E2
Footprint Width
11.58
11.51
11.43
.456
.453
.450
D1
Molded Package Length
11.58
11.51
11.43
.456
.453
.450
E1
Molded Package Width
12.57
12.45
12.32
.495
.490
.485
D
Overall Length
12.57
12.45
12.32
.495
.490
.485
E
Overall Width
0.25
0.13
0.00
.010
.005
.000
CH2
Corner Chamfer (others)
1.40
1.14
0.89
.055
.045
.035
CH1
Corner Chamfer 1
0.79
0.66
0.53
.031
.026
.021
A3
Side 1 Chamfer Height
0.51
.020
A1
Standoff
§
4.06
3.87
3.68
A2
Molded Package Thickness
4.57
4.39
4.19
.180
.173
.165
A
Overall Height
1.27
.050
p
Pitch
28
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
A2
c
E2
2
D
D1
n
#leads=n1
E
E1
1
A3
A
B1
32
°
B
p
D2
CH1 x 45
°
CH2 x 45
°
β
α
A1
.145
.153
.160
.028
.035
0.71
0.89
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-026
§ Significant Characteristic
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