参数资料
型号: TC77-5.0MOA
厂商: Microchip Technology
文件页数: 15/22页
文件大小: 374K
描述: IC SENSOR THERMAL SPI 5V 8SOIC
标准包装: 100
功能: 温度监控系统(传感器)
传感器类型: 内部
感应温度: -55°C ~ 125°C
精确度: ±3°C(最小值)
拓扑: ADC(三角积分型),寄存器库
输出类型: MICROWIRE?,SPI?
输出警报:
输出风扇:
电源电压: 2.7 V ~ 5.5 V
工作温度: -55°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 管件
产品目录页面: 682 (CN2011-ZH PDF)
配用: TC77DM-PICTL-ND - BOARD DEMO PICTAIL TC77
?2002 Microchip Technology Inc.
DS20092A-page 15
TC77
8-Lead Plastic Small Outline (SN)  Narrow, 150 mil (SOIC)
Foot Angle
?/DIV>
0
4
8
0
4
8
15
12
0
15
12
0
?/DIV>
Mold Draft Angle Bottom
15
12
0
15
12
0
?/DIV>
Mold Draft Angle Top
0.51
0.42
0.33
.020
.017
.013
B
Lead Width
0.25
0.23
0.20
.010
.009
.008
c
Lead Thickness
0.76
0.62
0.48
.030
.025
.019
L
Foot Length
0.51
0.38
0.25
.020
.015
.010
h
Chamfer Distance
5.00
4.90
4.80
.197
.193
.189
D
Overall Length
3.99
3.91
3.71
.157
.154
.146
E1
Molded Package Width
6.20
6.02
5.79
.244
.237
.228
E
Overall Width
0.25
0.18
0.10
.010
.007
.004
A1
Standoff  ?/DIV>
1.55
1.42
1.32
.061
.056
.052
A2
Molded Package Thickness
1.75
1.55
1.35
.069
.061
.053
A
Overall Height
1.27
.050
p
Pitch
8
8
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
2
1
D
n
p
B
E
E1
h
L
?/DIV>
c
45?/DIV>
?/DIV>
A2
?/DIV>
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
?Significant Characteristic
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