参数资料
型号: TC9400COD713
厂商: Microchip Technology
文件页数: 21/28页
文件大小: 545K
描述: IC V-FREQ/FREQ-V CONV 14SOIC
标准包装: 2,600
类型: 电压至频率和频率至电压
频率 - 最大: 100kHz
全量程: ±40ppm/°C
线性: ±0.05%
安装类型: 表面贴装
封装/外壳: 14-SOIC(0.154",3.90mm 宽)
供应商设备封装: 14-SOIC
包装: 带卷 (TR)
?2007 Microchip Technology Inc.
DS21483D-page 21
TC9400/9401/9402
14-Lead Plastic Small Outline (OD)  Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. ?Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC:Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:  For the most current package drawings, please see the Microchip Packaging Specification located at 
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits   MIN
NOM
MAX
Number of Pins
N
14
Pitch
e
1.27 BSC
Overall Height
A


1.75
Molded Package Thickness
A2    1.25


Standoff ?/DIV>
A1    0.10

0.25
Overall Width
E
6.00 BSC
Molded Package Width
E1
3.90 BSC
Overall Length
D
8.65 BSC
Chamfer (optional)
h    0.25

0.50
Foot Length
L    0.40

1.27
Footprint
L1
1.04 REF
Foot Angle
?/DIV>
0?/DIV>

8?/DIV>
Lead Thickness
c    0.17

0.25
Lead Width
b    0.31

0.51
Mold Draft Angle Top
?/DIV>
5?/DIV>

15?/DIV>
Mold Draft Angle Bottom
?/DIV>
5?/DIV>

15?/DIV>
NOTE 1
N
D
E
E1
1
2  3
b
e
A
A1
A2
L
L1
c
h
h
?/DIV>
?/DIV>
?/DIV>
MicrochipTechnologyDrawingC04-065B
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