参数资料
型号: TCM809RVNB713
厂商: Microchip Technology
文件页数: 9/16页
文件大小: 0K
描述: IC RESET MONITOR 2.63V SOT23B-3
标准包装: 1
类型: 简单复位/加电复位
监视电压数目: 1
输出: 推挽式,图腾柱
复位: 低有效
复位超时: 最小为 140 ms
电压 - 阀值: 2.63V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商设备封装: SOT-23-3
包装: 标准包装
产品目录页面: 662 (CN2011-ZH PDF)
其它名称: TCM809RVNB713DKR
TCM809/TCM810
3-Lead Plastic Small Outline Transistor (LB) (SC-70)
E
E1
B
2
p1
D
3
1
a
p
c
b
L
A
A2
A1
Units
INCHES
MILLIMETERS*
Number of Pins
Dimension Limits
MIN
3
MAX
MIN
3
MAX
Pitch
Outside lead pitch (basic)
p
p1
.026 BSC.
.051 BSC.
0.65 BSC.
1.30 BSC.
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A2
A1
E
E1
D
L
c
B
a
b
.031
.031
.000
.071
.045
.071
.004
.003
.006
.043
.039
.0004
.094
.053
.089
.016
.010
.016
12°
12°
0.80
0.80
0.00
1.80
1.15
1.80
0.10
0.08
0.15
1.10
1.00
.010
2.40
1.35
2.25
0.41
0.25
0.40
12°
12°
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .005" (0.127mm) per side.
JEITA (EIAJ) Equivalent: SC70
Drawing No. C04-104
? 2005 Microchip Technology Inc.
DS21661D-page 9
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