参数资料
型号: TCM811TERCTR
厂商: Microchip Technology
文件页数: 9/16页
文件大小: 0K
描述: IC RESET MONITOR 3.08V SOT143-4
标准包装: 3,000
类型: 简单复位/加电复位
监视电压数目: 1
输出: 推挽式,图腾柱
复位: 低有效
复位超时: 最小为 140 ms
电压 - 阀值: 3.08V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: TO-253-4,TO-253AA
供应商设备封装: SOT-143
包装: 带卷 (TR)
TCM811/TCM812
4-Lead Plastic Small Outline Transistor (RC) [SOT-143]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
e /2
N
E
E 1
1
e1
2
A
A2
φ
c
A 1
b2
3X b
L 1
L
Units
MILLIMETERS
Number of Pins
Pitch
Pin1 Offset
Dimension Limits
N
e
e1
MIN
NOM
4
1.92 BSC
0.20 BSC
MAX
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead 1 Width
Leads 2, 3 & 4 Width
A
A2
A1
E
E1
D
L
L1
φ
c
b1
b
0.80
0.75
0.01
2.10
1.20
2.67
0.13
0.08
0.76
0.30
0.90
1.30
2.90
0.50
0.54 REF
1.22
1.07
0.15
2.64
1.40
3.05
0.60
0.20
0.94
0.54
Notes:
1. § Significant Characteristic.
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-031B
? 2007 Microchip Technology Inc.
DS21615C-page 9
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