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参数资料
| 型号： | TDA1308T/N1,115 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 0.06 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 |
| 封装： | PLASTIC, SO-8 |
| 文件页数： | 6/26页 |
| 文件大小： | 197K |
| 代理商： | TDA1308T/N1,115 |
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VII. COMMERCIAL PRODUCT SPECIAL PROCESSING
SPECIAL PACKAGING ALTERNATIVES
SPECIFICATIONS
Tape and Reel specifications conform to Electronic Industries Association (EIA) standard EIA-481-1, EIA-481-2,
EIA-481-3, and EIA-468-B.
DEVICE AVAILABILITY
Plastic Leaded Chip Carrier (PLCC) and Plastic Small Outline (SO/SOL/SSOP/TSSOP) parts are available in tape
and reel packaging. Products available in tape and reel are identified in the Price Book with a "-T" (13”) or "-G" (7”)
added to the end of basic part number (e.g. N74F379AD-T or TDA1543TD-G). Return of product MUST be in full
reels with unbroken quality seals.
Plastic Quad Flat Pack (PQFP) parts are available in single tray packaging. Products available in single tray are
identified in the Price Book with a "-S" added to the end of basic part number (e.g. SAB9075HB-S). Return of
product MUST be in original container with unbroken quality seals.
VII. DRY PACK HANDLING
Philips Semiconductors is providing moisture barrier protection for plastic Surface Mount Technology (SMT) lCs
prior to shipping/storage. This protection is designed to minimize the absorption of water into the body of the pack-
age in high humidity environments and later causing damage to itself when exposed to the rapid thermal heating
associated with surface mount printed circuit board assembly. As the package is heated, moisture inside the pack-
age rapidly heats and vaporizes, generating pressure within the package, which can result in package cracking.
Philips Semiconductors has conducted susceptibility testing on its entire line of SMT packages and has found that
certain combinations of package outlines and lead frames are sensitive to this accelerated test. These packages
include specific, but not all varieties of Small Outline SO/SSOP-16/24/28 lead, Plastic Leaded Chip Carrier (PLCC)-
32/52/68/84 lead, and all Plastic Quad Flat Pack (PQFP).
Philips Semiconductors products that are dry packed are indicated in the price book with "DRY PACK" entered next
to the device in the "Cross Ref column.
The dry packing process begins with a 24-hour bake at 125°C after electrical test to remove any moisture build-up
within the package. Product is then packed under a partial vacuum in a moisture barrier bag containing desiccant
and a humidity indicator card. The bag interior is maintained at a relative humidity (RH) level of less than 30%.
Once outside the bag (in a typical factory environment of 20°C to 30°C and 50% to 70% RH), product should be
used within 48 hours. If this time is exceeded, or upon opening the bag, the humidity indicator card registers pink on
the 20% level, the product should be baked at 125°C for 24 hours. Product must be baked in metal tubes, not the
plastic tubes or reels in which it was shipped. PQFP products packed in trays can be baked at 125°C.
Philips Semiconductors complies with the recommendations of the NEDA Semiconductor Packing and Handling
Committee for Moisture Sensitive Plastic Surface Mount Components that is incorporated in NIGP 103.00. Our in-
ternal specifications are available upon request from Ron Deetz, 408-991-3892: 1) 874-0086, General Operator Dry
Packing Requirements; and 2) 874-0083, General Operator Dry Packing.
Dry packed products must be ordered in full tube or full tray increments and must also meet the order minimums as
determined by each device's Price Book inventory code (I/C).
Only factory Q.A. sealed containers, undamaged, with all labels intact are eligible for stock rotation. Philips Semi-
conductors recommends that the minimum quantity be imposed as a minimum buy to distributor's end customer.
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相关代理商/技术参数 |
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| TDA1308TT | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Class-AB stereo headphone driver |
| TDA1308TT/N1,118 | 功能描述:音频放大器 STEREO HEADPHONE DRIVER-TSSOP RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA1308TT/N2 | 制造商:NXP Semiconductors 功能描述:AMP AUDIO .08W STER AB 8TSSOP 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, .08W, STER, AB, 8TSSOP |
| TDA1308TT/N2,118 | 功能描述:音频放大器 STEREO HDPHON DRVR RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA1308TT/N2118 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 40mW TSSOP-8 |
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